Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifier with an integrated guard ring for stress protection, encapsulated in a SOD128 small and flat lead Surface-Mounted Device (SMD) plastic package.
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1 A low VF MEGA Schottky barrier rectifier (REV 1.0) PDF (91.0 kB) PMEG3010EP | 31 Dec 2008 |
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Thermal consideration of NXP® FlatPower MEGA Schottky barrier rectifiers - Selection criteria (REV 3.0) PDF (180.0 kB) AN10808 | 29 Apr 2015 |
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NXP® low VF (MEGA) Schottky rectifiers in CFP3 and CFP5 FlatPower packages (REV 1.0) PDF (986.0 kB) 75017640 | 20 Feb 2015 |
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Discretes Semiconductors Selection Guide 2016 (REV 1.0) PDF (47.9 MB) 75017631 | 17 Feb 2016 |
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plastic surface-mounted package; 2 leads (REV 1.0) PDF (178.0 kB) SOD128 | 08 Feb 2016 |
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Reel pack, SMD, 7" T1 standard product orientation Ordering code (12NC) ending 115 (REV 1.0) PDF (140.0 kB) SOD128_115 | 27 Mar 2014 |
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PMEG3010EP NXP® Product Reliability (REV 1.1) PDF (83.0 kB) PMEG3010EP_1 | 31 Jan 2015 |
PMEG3010EP NXP® Product Quality (REV 1.1) PDF (74.0 kB) PMEG3010EP_NXP_PRODUCT_QUALITY | 31 Jan 2015 |
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Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE | 30 Sep 2013 |
Product | Status | Package version | Package name | Size (mm) | IF (A) | VR (V) | Configuration | IR [max] (mA) | IFSM [max] (A) | Cd [max] (pF) | VF [max] (mV) |
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PMEG3010EP | Active | SOD128 | SOD128 | 3.8 x 2.5 x 1 | 1 | 30 | single | 1,5@VR=30V | 50 | 60@VR=10V | 360@IF=1A |
Product ID | Package Description | Outline Version | Reflow/Wave Soldering | Packing | Product Status | Part NumberOrdering code(12NC) | Marking | Chemical Content | RoHS / Pb Free / RHF | EFR | IFR(FIT) | MTBF(hour) | MSL | MSL LF |
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PMEG3010EP | SOD128 | Reflow_Soldering_Profile | Reel 7" Q1/T1 | Active | PMEG3010EP,115 (9340 614 68115) | A1 | PMEG3010EP | 157.0 | 0.73 | 1.37E9 | 1 | 1 |