PMEG3010ET: 1 A very low VF MEGA Schottky barrier rectifiers
Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifiers with an integrated guard ring for stress protection, encapsulated in small Surface-Mounted Device (SMD) plastic packages.
PMEG3010ET: Product Block Diagram
PMEG3010ET: Block Diagram
PMEG3010ET: Block Diagram
PMEG3010ET: Block Diagram
SOT023
Data Sheets (1)
| Name/Description | Modified Date |
|---|---|
| 1 A very low VF MEGA Schottky barrier rectifiers (REV 4.0) PDF (77.0 kB) PMEG3010EH_EJ_ET | 20 Mar 2007 |
Selector Guides (1)
| Name/Description | Modified Date |
|---|---|
| Discretes Semiconductors Selection Guide 2016 (REV 1.0) PDF (47.9 MB) 75017631 | 17 Feb 2016 |
Package Information (1)
| Name/Description | Modified Date |
|---|---|
| plastic surface-mounted package; 3 leads (REV 1.0) PDF (213.0 kB) SOT23 | 08 Feb 2016 |
Packing (1)
| Name/Description | Modified Date |
|---|---|
| Tape reel SMD; standard product orientation 12NC ending 215 (REV 1.0) PDF (202.0 kB) SOT23_215 | 16 Nov 2012 |
Reliability and Quality Information (2)
| Name/Description | Modified Date |
|---|---|
| PMEG3010ET NXP® Product Reliability (REV 1.1) PDF (83.0 kB) PMEG3010ET | 31 Jan 2015 |
| PMEG3010ET NXP® Product Quality (REV 1.1) PDF (74.0 kB) PMEG3010ET_NXP_PRODUCT_QUALITY | 31 Jan 2015 |
Supporting Information (2)
| Name/Description | Modified Date |
|---|---|
| Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE | 30 Sep 2013 |
| Wave Soldering Profile (REV 1.0) PDF (20.0 kB) WAVE_SOLDERING_PROFILE | 30 Sep 2013 |
SPICE model
- PMEG3010ET SPICE model (REV 1.4) prm PMEG3010ET_1 7/22/2012
Ordering Information
| Product | Status | Package version | Package name | Size (mm) | IF (A) | VR (V) | Configuration | IR [max] (mA) | IFSM [max] (A) | Cd [max] (pF) | VF [max] (mV) |
|---|---|---|---|---|---|---|---|---|---|---|---|
| PMEG3010ET | Active | SOT23 | TO-236AB | 2.9 x 1.3 x 1 | 1 | 30 | single | 0,15@VR=30V | 9 | 70@VR=1V | 560@IF=1A |
Package Information
| Product ID | Package Description | Outline Version | Reflow/Wave Soldering | Packing | Product Status | Part NumberOrdering code(12NC) | Marking | Chemical Content | RoHS / Pb Free / RHF | LeadFree Conversion Date | EFR | IFR(FIT) | MTBF(hour) | MSL | MSL LF |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| PMEG3010ET | | SOT23 | Reflow_Soldering_Profile
Wave_Soldering_Profile Reflow_Soldering_Profile Wave_Soldering_Profile | Reel 7" Q3/T4 | Active | PMEG3010ET,215 (9340 610 49215) | %AV | PMEG3010ET |    | Always Pb-free | 157.0 | 0.73 | 1.37E9 | 1 | 1 |
- Discretes Semiconductors Selection Guide 2016 BUK7M12-60E
- PMEG3010ET NXP® Product Reliability PMEG3010ET
- PMEG3010ET NXP® Product Quality PMEG3010ET
- PMEG3010ET SPICE model PMEG3010ET
- plastic surface-mounted package; 3 leads BSS84AK
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- Tape reel SMD; standard product orientation 12NC ending 215 BSS84AK
- TL431_FAMILY
- 1PSXSB17
- 1PSXSB17
- PMBFJ309
