PMEG4010CPA: 1 A low V_F dual MEGA Schottky barrier rectifier
Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifier in common cathode configuration with an integrated guard ring for stress protection, encapsulated in a SOT1061 leadless small Surface-Mounted Device (SMD) plastic package with medium power capability.
Outline 3d SOT1061
Data Sheets (1)
| Name/Description | Modified Date |
|---|---|
| 1 A low V_F dual MEGA Schottky barrier rectifier (REV 1.0) PDF (319.0 kB) PMEG4010CPA | 07 Sep 2010 |
Application Notes (1)
| Name/Description | Modified Date |
|---|---|
| Leadless Schottky diodes in a DC-to-DC step-up converter (REV 1.1) PDF (562.0 kB) AN11470 | 06 Mar 2015 |
Brochures (1)
| Name/Description | Modified Date |
|---|---|
| 1 and 2 A Schottky rectifiers in leadless medium-power package; NXP® low VF (MEGA) Schottky rectifier... (REV 1.0) PDF (2.6 MB) 75017425 | 20 Apr 2013 |
Selector Guides (1)
| Name/Description | Modified Date |
|---|---|
| Discretes Semiconductors Selection Guide 2016 (REV 1.0) PDF (47.9 MB) 75017631 | 17 Feb 2016 |
Package Information (1)
| Name/Description | Modified Date |
|---|---|
| DFN2020-3: plastic thermal enhanced ultra thin small outline package; no leads; 3 terminals; body 2 x 2 x 0.65 mm (REV 1.0) PDF (185.0 kB) SOT1061 | 08 Feb 2016 |
Packing (1)
| Name/Description | Modified Date |
|---|---|
| DFN2020-3; reel pack; standard product orientation; 12NC ending 115 (REV 1.0) PDF (261.0 kB) SOT1061_115 | 07 Nov 2012 |
Reliability and Quality Information (2)
| Name/Description | Modified Date |
|---|---|
| PMEG4010CPA NXP® Product Reliability (REV 1.1) PDF (83.0 kB) PMEG4010CPA_1 | 31 Jan 2015 |
| PMEG4010CPA NXP® Product Quality (REV 1.1) PDF (74.0 kB) PMEG4010CPA_NXP_PRODUCT_QUALITY | 31 Jan 2015 |
Supporting Information (1)
| Name/Description | Modified Date |
|---|---|
| Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE | 30 Sep 2013 |
SPICE model
- PMEG4010CPA SPICE model (REV 1.5) TXT PMEG4010CPA_1_2 7/22/2012
Ordering Information
| Product | Status | Package version | Package name | Size (mm) | IF (A) | VR (V) | Configuration | IR [max] (mA) | IFSM [max] (A) | Cd [max] (pF) | VF [max] (mV) |
|---|---|---|---|---|---|---|---|---|---|---|---|
| PMEG4010CPA | Active | SOT1061 | DFN2020-3 | 2 x 2 x 0.65 | 1 | 40 | dual c.c. | 0,055@VR=40V | 9 | 50@VR=10V | 500@IF=1A |
Package Information
| Product ID | Package Description | Outline Version | Reflow/Wave Soldering | Packing | Product Status | Part NumberOrdering code(12NC) | Marking | Chemical Content | RoHS / Pb Free / RHF | LeadFree Conversion Date | EFR | IFR(FIT) | MTBF(hour) | MSL | MSL LF |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| PMEG4010CPA | | SOT1061 | Reflow_Soldering_Profile | Reel 7" Q1/T1 | Active | PMEG4010CPA,115 (9340 643 48115) | AN | PMEG4010CPA |    | Always Pb-free | 157.0 | 0.73 | 1.37E9 | 1 | 1 |
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- Discretes Semiconductors Selection Guide 2016 BUK7M12-60E
- PMEG4010CPA NXP® Product Reliability PMEG4010CPA
- PMEG4010CPA NXP® Product Quality PMEG4010CPA
- PMEG4010CPA SPICE model PMEG4010CPA
- DFN2020-3: plastic thermal enhanced ultra thin small outline package; no leads; 3 terminals; body 2 x 2 x 0.65 mm PMEG6020EPA
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- DFN2020-3; reel pack; standard product orientation; 12NC ending 115 PMEG6020EPA
- PTVSXU1UPA_SERIES
