PMEG6002ELD: 60 V, 0.2 A low VF MEGA Schottky barrier rectifier
Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifier with an integrated guard ring for stress protection, encapsulated in a leadless ultra small SOD882D (DFN1006D-2) Surface-Mounted Device (SMD) plastic package with visible and solderable side pads.
-
Data Sheets (1)
| Name/Description | Modified Date |
|---|---|
| 60 V, 0.2 A low VF MEGA Schottky barrier rectifier (REV 4.0) PDF (213.0 kB) PMEG6002ELD | 05 Feb 2014 |
Application Notes (1)
| Name/Description | Modified Date |
|---|---|
| Leadless Schottky diodes in a DC-to-DC step-up converter (REV 1.1) PDF (562.0 kB) AN11470 | 06 Mar 2015 |
Selector Guides (1)
| Name/Description | Modified Date |
|---|---|
| Discretes Semiconductors Selection Guide 2016 (REV 1.0) PDF (47.9 MB) 75017631 | 17 Feb 2016 |
Package Information (1)
| Name/Description | Modified Date |
|---|---|
| DFN1006D-2: leadless ultra small plastic package; 2 terminals (REV 1.0) PDF (182.0 kB) SOD882D | 08 Feb 2016 |
Reliability and Quality Information (2)
| Name/Description | Modified Date |
|---|---|
| PMEG6002ELD NXP® Product Reliability (REV 1.1) PDF (83.0 kB) PMEG6002ELD_1 | 31 Jan 2015 |
| PMEG6002ELD NXP® Product Quality (REV 1.1) PDF (74.0 kB) PMEG6002ELD_NXP_PRODUCT_QUALITY | 31 Jan 2015 |
Supporting Information (1)
| Name/Description | Modified Date |
|---|---|
| Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE | 30 Sep 2013 |
SPICE model
- PMEG6002ELD SPICE model (REV 1.0) TXT PMEG6002ELD_1_2 5/30/2013
Ordering Information
| Product | Status | Package version | Package name | Size (mm) | IF (A) | VR (V) | Configuration | IR [max] (mA) | IFSM [max] (A) | Cd [max] (pF) | VF [max] (mV) | Remark |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| PMEG6002ELD | Active | SOD882D | DFN1006D-2 | 1 x 0.6 x 0.4 | 0.2 | 60 | single | 0,1@VR=60V | 2.75 | 6@VR=10V | 600@IF=0,2A | solderable side pads |
Package Information
| Product ID | Package Description | Outline Version | Reflow/Wave Soldering | Packing | Product Status | Part NumberOrdering code(12NC) | Marking | Chemical Content | RoHS / Pb Free / RHF | LeadFree Conversion Date | EFR | IFR(FIT) | MTBF(hour) | MSL | MSL LF |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| PMEG6002ELD | | SOD882D | Reflow_Soldering_Profile | Reel 7" Q1/T1 Pitch 2mm | Active | PMEG6002ELDYL (9340 676 62315) | 1111 1010 |    | Always Pb-free | 157.0 | 0.73 | 1.37E9 | 1 | 1 |
- Leadless Schottky diodes in a DC-to-DC step-up converter PMEG6020EPA
- Discretes Semiconductors Selection Guide 2016 BUK7M12-60E
- PMEG6002ELD NXP® Product Reliability PMEG6002ELD
- PMEG6002ELD NXP® Product Quality PMEG6002ELD
- PMEG6002ELD SPICE model PMEG6002ELD
- DFN1006D-2: leadless ultra small plastic package; 2 terminals pesd5v0x1uld
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- BB187LX
