PMEG6030EVP: High-temperature 60 V, 3 A Schottky barrier rectifier
Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifier with an integrated guard ring for stress protection, encapsulated in a SOD128 small and flat lead Surface-Mounted Device (SMD) plastic package.
sod128_3d
Data Sheets (1)
| Name/Description | Modified Date |
|---|---|
| High-temperature 60 V, 3 A, low VF MEGA Schottky barrier rectifier (REV 1.0) PDF (213.0 kB) PMEG6030EVP | 04 Mar 2013 |
Application Notes (2)
| Name/Description | Modified Date |
|---|---|
| Parallel Schottkys as secondary rectifiers in flyback adapter: power losses and junction temperatures (REV 1.0) PDF (490.0 kB) AN11358 | 06 Mar 2015 |
| FlatPower Schottky rectifier in low power adapter (REV 2.0) PDF (472.0 kB) AN11310 | 08 Apr 2013 |
Brochures (1)
| Name/Description | Modified Date |
|---|---|
| NXP® low VF (MEGA) Schottky rectifiers in CFP3 and CFP5 FlatPower packages (REV 1.0) PDF (986.0 kB) 75017640 | 20 Feb 2015 |
Selector Guides (1)
| Name/Description | Modified Date |
|---|---|
| Discretes Semiconductors Selection Guide 2016 (REV 1.0) PDF (47.9 MB) 75017631 | 17 Feb 2016 |
Package Information (1)
| Name/Description | Modified Date |
|---|---|
| plastic surface-mounted package; 2 leads (REV 1.0) PDF (178.0 kB) SOD128 | 08 Feb 2016 |
Packing (1)
| Name/Description | Modified Date |
|---|---|
| Reel pack, SMD, 7" T1 standard product orientation Ordering code (12NC) ending 115 (REV 1.0) PDF (140.0 kB) SOD128_115 | 27 Mar 2014 |
Reliability and Quality Information (2)
| Name/Description | Modified Date |
|---|---|
| PMEG6030EVP NXP® Product Reliability (REV 1.1) PDF (83.0 kB) PMEG6030EVP_1 | 31 Jan 2015 |
| PMEG6030EVP NXP® Product Quality (REV 1.1) PDF (74.0 kB) PMEG6030EVP_NXP_PRODUCT_QUALITY | 31 Jan 2015 |
Supporting Information (1)
| Name/Description | Modified Date |
|---|---|
| Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE | 30 Sep 2013 |
SPICE model
- PMEG6030EVP SPICE model (REV 1.0) TXT PMEG6030EVP_1_2 5/10/2016
Ordering Information
| Product | Status | Package version | Package name | Size (mm) | IF (A) | VR (V) | Configuration | IR [max] (mA) | IFSM [max] (A) | Cd [max] (pF) | VF [max] (mV) | Remark |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| PMEG6030EVP | Active | SOD128 | SOD128 | 3.8 x 2.5 x 1 | 3 | 60 | single | 0,4@VR=60V | 70 | 200@VR=10V | 475@IF=3A | Tmax = 175 C |
Package Information
| Product ID | Package Description | Outline Version | Reflow/Wave Soldering | Packing | Product Status | Part NumberOrdering code(12NC) | Marking | Chemical Content | RoHS / Pb Free / RHF | EFR | IFR(FIT) | MTBF(hour) | MSL | MSL LF |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| PMEG6030EVP | | SOD128 | Reflow_Soldering_Profile | Reel 7" Q1/T1 | Active | PMEG6030EVPX (9340 675 92115) | DB | PMEG6030EVP |   | 157.0 | 0.73 | 1.37E9 | 1 | 1 |
- Parallel Schottkys as secondary rectifiers in flyback adapter: power losses and junction temperatures PMEG6045ETP
- FlatPower Schottky rectifier in low power adapter PMEG6045ETP
- NXP® low VF (MEGA) Schottky rectifiers in CFP3 and CFP5 FlatPower packages SOD123W_SOD128_AUTOMOTIVE
- Discretes Semiconductors Selection Guide 2016 BUK7M12-60E
- PMEG6030EVP NXP® Product Reliability PMEG6030EVP
- PMEG6030EVP NXP® Product Quality PMEG6030EVP
- PMEG6030EVP SPICE model PMEG6030EVP
- plastic surface-mounted package; 2 leads ptvsxp1up_automotive
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- Reel pack, SMD, 7" T1 standard product orientation Ordering code (12NC) ending 115 ptvsxp1up_automotive
- PTVSXP1UTP_SERIES
