PMN27XPEA: 20 V, single P-channel Trench MOSFET
P-channel enhancement mode Field-Effect Transistor (FET) in a small SOT457 (SC-74) Surface-Mounted Device (SMD) plastic package using Trench MOSFET technology.
SOT457
Data Sheets (1)
| Name/Description | Modified Date |
|---|---|
| 20 V, single P-channel Trench MOSFET (REV 1.0) PDF (278.0 kB) PMN27XPEA | 19 Jun 2014 |
Application Notes (6)
| Name/Description | Modified Date |
|---|---|
| Using power MOSFETs in parallel (REV 1.0) PDF (184.0 kB) AN11599 | 13 Jul 2016 |
| LFPAK MOSFET thermal design guide - Part 2 (REV 2.0) PDF (2.6 MB) AN11113_ZH | 22 May 2014 |
| Using RC Thermal Models (REV 2.0) PDF (1.0 MB) AN11261 | 19 May 2014 |
| LFPAK MOSFET thermal design guide, Chinese version (REV 1.0) PDF (515.0 kB) AN10874_ZH | 14 Sep 2012 |
| LFPAK MOSFET thermal design guide - Part 2 (REV 2.0) PDF (2.5 MB) AN11113 | 16 Nov 2011 |
| LFPAK MOSFET thermal design guide (REV 2.0) PDF (401.0 kB) AN10874 | 27 Jan 2011 |
Selector Guides (1)
| Name/Description | Modified Date |
|---|---|
| Discretes Semiconductors Selection Guide 2016 (REV 1.0) PDF (47.9 MB) 75017631 | 17 Feb 2016 |
Package Information (1)
| Name/Description | Modified Date |
|---|---|
| plastic surface-mounted package (TSOP6); 6 leads (REV 1.0) PDF (248.0 kB) SOT457 | 08 Feb 2016 |
Packing (1)
| Name/Description | Modified Date |
|---|---|
| TSOP6; Tape reel SMD; standard product orientation 12NC ending 115 (REV 1.0) PDF (187.0 kB) SOT457_115 | 30 Nov 2012 |
Reliability and Quality Information (2)
| Name/Description | Modified Date |
|---|---|
| PMN27XPEA NXP® Product Reliability (REV 1.1) PDF (84.0 kB) PMN27XPEA_1 | 31 Jan 2015 |
| PMN27XPEA NXP® Product Quality (REV 1.1) PDF (74.0 kB) PMN27XPEA_NXP_PRODUCT_QUALITY | 31 Jan 2015 |
Supporting Information (4)
| Name/Description | Modified Date |
|---|---|
| Power MOSFET frequently asked questions and answers (REV 2.0) PDF (1.6 MB) TN00008 | 31 Oct 2016 |
| Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE | 30 Sep 2013 |
| Wave Soldering Profile (REV 1.0) PDF (20.0 kB) WAVE_SOLDERING_PROFILE | 30 Sep 2013 |
| MAR_SOT457 Topmark (REV 1.0) PDF (113.0 kB) MAR_SOT457 | 03 Jun 2013 |
SPICE model
- PMN27XPEA Spice model (REV 1.0) lib PMN27XPEA_18_06_2014 1/27/2015
Ordering Information
| Product | Status | Package version | Package name | Channel type | Number of transistors | VDS [max] (V) | RDSon [max] @ VGS = 10 V (mΩ) | RDSon [max] @ VGS = 5 V (mΩ) | RDSon [max] @ VGS = 4.5 V (mΩ) | RDSon [max] @ VGS = 2.5 V (mΩ) | ID [max] (A) | QGD [typ] (nC) | QG(tot) [typ] @ VGS = 4.5 V (nC) | RDSon [typ] @ VGS = 4.5 V (mΩ) | QG(tot) [typ] (nC) | Ptot [max] (W) | QG(tot) [typ] @ VGS = 10 V (nC) | RDSon [typ] @ VGS = 2.5 V (mΩ) | Qr [typ] (nC) | VGSth [typ] (V) | Automotive qualified | ID [max] @ T = 100 °C (A) | IDM [max] (A) | Ciss [typ] (pF) | Coss [typ] (pF) | Date | Rth(j-mb) [max] (K/W) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| PMN27XPEA | Active | SOT457 | TSOP6 | P | 1 | -20 | 30 | 44 | -5.7 | 3 | 15 | 27 | 15 | 0.53 | 39 | -1 | Y | -3.5 | -22 | 1770 | 254 | 2014-06-20 | 1770 |
Package Information
| Product ID | Package Description | Outline Version | Reflow/Wave Soldering | Packing | Product Status | Part NumberOrdering code(12NC) | Marking | Chemical Content | RoHS / Pb Free / RHF | LeadFree Conversion Date | EFR | IFR(FIT) | MTBF(hour) | MSL | MSL LF |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| PMN27XPEA | | SOT457 | Reflow_Soldering_Profile
Wave_Soldering_Profile Reflow_Soldering_Profile Wave_Soldering_Profile | Reel 7" Q1/T1 | Active | PMN27XPEAX (9340 685 51115) | BD | PMN27XPEA |    | Always Pb-free | 234.0 | 1.08 | 9.26E8 | 1 | 1 |
- 20 V, single P-channel Trench MOSFET pmn27xpea
- Using power MOSFETs in parallel BUK7M12-60E
- LFPAK MOSFET thermal design guide - Part 2 BUK7K8R7-40E
- Using RC Thermal Models BUK7M12-60E
- LFPAK MOSFET thermal design guide, Chinese version BUK7K8R7-40E
- LFPAK MOSFET thermal design guide - Part 2 BUK7M12-60E
- LFPAK MOSFET thermal design guide BUK7M12-60E
- Discretes Semiconductors Selection Guide 2016 BUK7M12-60E
- PMN27XPEA NXP® Product Reliability pmn27xpea
- PMN27XPEA NXP® Product Quality pmn27xpea
- Power MOSFET frequently asked questions and answers BUK7M12-60E
- MAR_SOT457 Topmark 74LVC2G17_Q100
- PMN27XPEA Spice model PMN27XPEA
- plastic surface-mounted package (TSOP6); 6 leads 74LVC2G17_Q100
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- TSOP6; Tape reel SMD; standard product orientation 12NC ending 115 pesd5v0s5ud
- SSL5021_SSL5031
