PUMB2: PNP/PNP resistor-equipped transistors; R1 = 47 kΩ, R2 = 47 kΩ

PNP/PNP double Resistor-Equipped Transistors (RET) in Surface-Mounted Device (SMD) plastic packages.

SOT363
Data Sheets (1)
Name/DescriptionModified Date
PNP/PNP resistor-equipped transistors; R1 = 47 kOhm, R2 = 47 kOhm (REV 3.0) PDF (618.0 kB) PEMB2_PUMB224 Nov 2011
Package Information (1)
Name/DescriptionModified Date
plastic surface-mounted package; 6 leads (REV 1.0) PDF (246.0 kB) SOT363_108 Feb 2016
Packing (1)
Name/DescriptionModified Date
TSSOP6; Tape reel SMD; standard product orientation 12NC ending 115 (REV 1.0) PDF (187.0 kB) SOT363_11515 Nov 2012
Reliability and Quality Information (2)
Name/DescriptionModified Date
PUMB2 NXP® Product Quality (REV 1.1) PDF (74.0 kB) PUMB2_NXP_PRODUCT_QUALITY31 Jan 2015
PUMB2 NXP® Product Reliability (REV 1.1) PDF (82.0 kB) PUMB2_NXP_PRODUCT_RELIABILITY31 Jan 2015
Supporting Information (3)
Name/DescriptionModified Date
Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE30 Sep 2013
Wave Soldering Profile (REV 1.0) PDF (20.0 kB) WAVE_SOLDERING_PROFILE30 Sep 2013
MAR_SOT363 Topmark (REV 1.0) PDF (104.0 kB) MAR_SOT36303 Jun 2013
Design Support
SPICE model
Ordering Information
ProductStatusPackage versionPackage nameSize (mm)channel typePtot (mW)R2 (typ) (kΩ)IC [max] (mA)R1 (typ) (kΩ)VCEO (V)
PUMB2ActiveSOT363TSSOP62 x 1.25 x 0.95PNP/PNP300471004750
PUMB2/A2No Longer ManufacturedSOT363TSSOP62 x 1.25 x 0.95PNP/PNP300471004750
Package Information
Product IDPackage DescriptionOutline VersionReflow/Wave SolderingPackingProduct StatusPart NumberOrdering code(12NC)MarkingChemical ContentRoHS / Pb Free / RHFLeadFree Conversion DateEFRIFR(FIT)MTBF(hour)MSLMSL LF
PUMB2SOT363Reflow_Soldering_Profile Wave_Soldering_Profile
Reflow_Soldering_Profile Wave_Soldering_Profile
Reel 7" Q1/T1ActivePUMB2,115 (9340 554 43115)B%2PUMB2week 23, 2003153.00.711.41E911