TEA1708T: GreenChip X capacitor discharge IC

The TEA1708 is an automatic discharge IC for X capacitors with a low power consumption (typically 1 mW at 230 V (AC).

A 500 V clamping circuit is integrated, protecting the IC during mains surges. In a typical application with only two 200 kΩ resistors, the maximum differential mode mains surge voltage allowed exceeds 6 kV. A metal oxide varistor is not required to protect the IC.

The X capacitor discharge current is internally limited to 2.3 mA. The discharge delay timer is set externally using a low voltage capacitor.

The very low power consumption in combination with a large discharge current enables the use of a large value X capacitor to reduce EMI while retaining the low standby power.

TEA1708T: Product Block Diagram
sot096-1_3d
Data Sheets (1)
Name/DescriptionModified Date
TEA1708T GreenChip X capacitor discharge IC (REV 1.0) PDF (111.0 kB) TEA1708T25 Sep 2013
Users Guides (1)
Name/DescriptionModified Date
GreenChip TEA1708T automatic discharge for X capacitors demo board (REV 1.0) PDF (169.0 kB) UM1072703 Oct 2013
Brochures (1)
Name/DescriptionModified Date
NXP® GreenChip X-capacitor discharge IC TEA1708 (REV 2.0) PDF (509.0 kB) 7501746412 Dec 2013
Package Information (1)
Name/DescriptionModified Date
plastic small outline package; 8 leads; body width 3.9 mm (REV 1.0) PDF (244.0 kB) SOT96-108 Feb 2016
Packing (1)
Name/DescriptionModified Date
SO8; Reel pack; SMD, 13" Q1/T1 Standard product orientation Orderable part number ending ,118 or J Ordering... (REV 2.0) PDF (232.0 kB) SOT96-1_11819 Apr 2013
Reliability and Quality Information (1)
Name/DescriptionModified Date
TEA1708 Nemko Certification (REV 1.0) PDF (335.0 kB) TEA1708_NEMKO_CERTIFICATION_108 Oct 2014
Reports or Presentations (1)
Name/DescriptionModified Date
TEA1708 datasheet for Nemko test (REV 1.0) PDF (511.0 kB) TEA1708_DATA_SHEET_FOR_NEMKO_T13 Dec 2013
Supporting Information (3)
Name/DescriptionModified Date
Wave Soldering Profile (REV 1.0) PDF (20.0 kB) WAVE_SOLDERING_PROFILE30 Sep 2013
Footprint for reflow soldering (REV 1.0) PDF (9.0 kB) SO-SOJ-REFLOW08 Oct 2009
Footprint for wave soldering (REV 1.0) PDF (8.0 kB) SO-SOJ-WAVE08 Oct 2009
Ordering Information
ProductStatusPackage versionPackage nameTopologyfosc (kHz)fosc peak (kHz)fosc high (kHz)fosc medium (kHz)fburst (kHz)VCC [max] (V)SoftstartFeatures
TEA1708T/1ActiveSO8410
Package Information
Product IDPackage DescriptionOutline VersionReflow/Wave SolderingPackingProduct StatusPart NumberOrdering code(12NC)MarkingChemical ContentRoHS / Pb Free / RHFLeadFree Conversion DateMSLMSL LF
TEA1708T/1SOT96-1SO-SOJ-REFLOW SO-SOJ-WAVE
SO-SOJ-REFLOW SO-SOJ-WAVE
Reel 13" Q1/T1ActiveTEA1708T/1J (9353 007 96118)Standard MarkingTEA1708T/1Always Pb-free11
TEA1708T GreenChip X capacitor discharge IC TEA1708T
GreenChip TEA1708T automatic discharge for X capacitors demo board TEA1708T
NXP® GreenChip X-capacitor discharge IC TEA1708 TEA1708T
TEA1708 Nemko Certification TEA1708T
TEA1708 datasheet for Nemko test TEA1708T
Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
plastic small outline package; 8 leads; body width 3.9 mm CBT3306_Q100
Footprint for reflow soldering NPIC6C596A_Q100
Footprint for wave soldering NPIC6C596A_Q100
SO8; Reel pack; SMD, 13" Q1/T1 Standard product orientation Orderable part number ending ,118 or J Ordering... CBT3306_Q100
TEA1708T
SA612A