TEA1905: USB-PD type C controller for SMPS
The TEA1905 is a USB Power Delivery (USB-PD) type-C and other proprietary protocol (Quick Charge) controller with a high integration level and near fully digital bare minimum of external components. The TEA1905 USB-PD controller drives an NMOS load switch. It achieves a very high power density Switching Mode Power Supply (SMPS) with an ultra-high efficiency over the entire load range. When applied in combination with the NXP Semiconductors primary controller, TEA1936T, it meets the CoC Tier-2, EuP lot 6, and DOE v6 energy efficiency requirement specifications.
In addition to the power control and required protections, the TEA1905 incorporates the full feature set of the type C USB-PD protocol that is required for an AC-to-DC SMPS adapter.
The SW pin is used to drive an external load switch (NMOS), which enables/disables the power over Vbus. When the output voltage is reduced or the type-C cable is detached, the DISCH pin ensures that the output voltage discharges in a controlled way to the voltage level required by the USB-PD protocol.
The TEA1905 incorporates all required protections, like OverTemperature Protection (OTP), adaptive OverVoltage Protection (OVP), Short Circuit Protection (SCP), and UnderVoltage LockOut (UVLO) protection.
- High integration level (only requires an external line switch and SR diode or controller)
- NMOS load switch without external winding
- Fault handling at secondary side without second optocoupler
- Low-cost SO14 package (suitable for both reflow soldering and wave soldering) or leadless HVSON16 package for smaller size (reflow only)
- Low-cost Bill Of Materials (BOM; ≈15 external components)
- Very low no-load power (< 25 mW for the complete system solution)
- High power density
- Ultra-high efficiency
Package Information (1)
| Name/Description | Modified Date |
|---|---|
| plastic small outline package; 14 leads; body width 3.9 mm (REV 1.0) PDF (166.0 kB) SOT108-1 | 08 Feb 2016 |
Packing (1)
| Name/Description | Modified Date |
|---|---|
| SO14; Reel pack; SMD, 13" Q1/T1 Standard product orientation Orderable part number ending ,118 or J Ordering... (REV 4.0) PDF (207.0 kB) SOT108-1_118 | 08 Apr 2013 |
Supporting Information (2)
| Name/Description | Modified Date |
|---|---|
| Footprint for reflow soldering (REV 1.0) PDF (9.0 kB) SO-SOJ-REFLOW | 08 Oct 2009 |
| Footprint for wave soldering (REV 1.0) PDF (8.0 kB) SO-SOJ-WAVE | 08 Oct 2009 |
Ordering Information
| Product | Status |
|---|---|
| TEA1905T | Introduction Pending |
Package Information
| Product ID | Package Description | Outline Version | Reflow/Wave Soldering | Packing | Product Status | Part NumberOrdering code(12NC) | Marking | Chemical Content | RoHS / Pb Free / RHF | LeadFree Conversion Date | MSL | MSL LF |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| TEA1905TK/1 |  | Reel 13" Q1/T1 | Development | TEA1905TK/1J (9353 082 11118) | Standard Marking |    | Always Pb-free | 1 | 1 | |||
| TEA1905T/1 |  | SOT108-1 | SO-SOJ-REFLOW
SO-SOJ-WAVE SO-SOJ-REFLOW SO-SOJ-WAVE | Reel 13" Q1/T1 | Development | TEA1905T/1J (9353 084 76118) | Standard Marking |
- plastic small outline package; 14 leads; body width 3.9 mm 74LV164_Q100
- Footprint for reflow soldering NPIC6C596A_Q100
- Footprint for wave soldering NPIC6C596A_Q100
- SO14; Reel pack; SMD, 13" Q1/T1 Standard product orientation Orderable part number ending ,118 or J Ordering... 74LV164_Q100
- UBA2213
