BAP63LX: BAP63LX

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Data Sheets (1)
Name/DescriptionModified Date
Silicon PIN diode (REV 2.0) PDF (230.0 kB) BAP63LX [English]06 Aug 2013
Package Information (1)
Name/DescriptionModified Date
DFN1006D-2: leadless ultra small plastic package; 2 terminals (REV 1.0) PDF (182.0 kB) SOD882D [English]08 Feb 2016
Supporting Information (1)
Name/DescriptionModified Date
Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English]30 Sep 2013
Ordering Information
ProductStatusPackage versionNo of diodesdiode configurationVR [max] (V)IF [max] (mA)rD [typ] (ohm)rD [max] (ohm)@IF (mA)@f (MHz)Cd [typ] (pF)@VR (V)Cd [max] (pF)
BAP63LXEnd of LifeSOD882D1SG501001.191.8101000.291
Package Information
Product IDPackage DescriptionOutline VersionReflow/Wave SolderingPackingProduct StatusPart NumberOrdering code(12NC)MarkingChemical ContentRoHS / Pb Free / RHFLeadFree Conversion DateMSLMSL LF
BAP63LXSOD882DReflow_Soldering_ProfileReel 7" Q1/T1 Pitch 2mmDiscontinuedBAP63LX,315 (9340 612 41315)1001 0101Always Pb-free11
Silicon PIN diode BAP63LX
Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
Footprint for reflow soldering SOD882D BB187LX
Leadless ultra small plastic package; 2 terminals BB187LX