Single low-leakage current switching diode encapsulated in a leadless ultra small DFN1010D-3 (SOT1215) Surface-Mounted Device (SMD) plastic package with visible and solderable side pads.
Name/Description | Modified Date |
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Low-leakage diode (REV 1.0) PDF (270.0 kB) BAS116QA [English] | 03 May 2016 |
Name/Description | Modified Date |
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DFN1010D-3: plastic thermal enhanced ultra thin small outline package; no leads; 3 terminals; body 1.1 x 1.0 x 0.37 mm (REV 1.0) PDF (191.0 kB) SOT1215 [English] | 08 Feb 2016 |
Name/Description | Modified Date |
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Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English] | 30 Sep 2013 |
Product | Status | Package version | Package name | Size (mm) | VR max (V) | VR [max] (V) | IFSM [max] (A) | IF max (mA) | VF [max] (mV) | Configuration | IR [max] (nA) | trr max (ns) | IFRM (mA) | VFmax (mV) | IR max (nA) | IFSM max (A) | trr [max] (ns) | IFRM (mA) | IF [max] (mA) | Cd max. (pF) | Cd [max] (pF) |
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BAS116QA | Active | SOT1215 | DFN1010D-3 | 1.1 x 1.0 x 0.37 | 75 | 4 | 1000@IF=10mA | single | 5@VR=75V | 700 | 3000 | 300 | 2 |
Product ID | Package Description | Outline Version | Reflow/Wave Soldering | Packing | Product Status | Part NumberOrdering code(12NC) | Marking | Chemical Content | RoHS / Pb Free / RHF | LeadFree Conversion Date | EFR | IFR(FIT) | MTBF(hour) | MSL | MSL LF |
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BAS116QA | SOT1215 | Reflow_Soldering_Profile | Reel 7" Q2/T3 | Active | BAS116QAZ (9340 698 86147) | Z 110 | BAS116QA | Always Pb-free | 347.0 | 1.61 | 6.21E8 | 1 | 1 |