BAS16J: High-speed switching diodes _ BDTIC a Leading Distributor in China

BAS16J: High-speed switching diodes

High-speed switching diodes, encapsulated in small Surface-Mounted Device (SMD) plastic packages.

sod323f_3d

Data Sheets (1)

Name/Description	Modified Date
High-speed switching diodes (REV 6.0) PDF (286.0 kB) BAS16_SER [English]	24 Sep 2014

Application Notes (2)

Name/Description	Modified Date
Brushless DC motor control using the LPC2141 (REV 1.0) PDF (426.0 kB) AN10661 [English]	18 Oct 2007
TDA8790M Evaluation board documentation (REV 1.0) PDF (516.0 kB) AN96031 [English]	16 Dec 2002

Brochures (1)

Name/Description	Modified Date
Create smarter, more efficient white goods; An industry-leading portfolio of cost-effective, power-saving solutions for... (REV 1.0) PDF (1.1 MB) 75016543 [English]	01 Jun 2008

Selector Guides (1)

Name/Description	Modified Date
Discretes Semiconductors Selection Guide 2016 (REV 1.0) PDF (47.9 MB) 75017631 [English]	17 Feb 2016

Package Information (1)

Name/Description	Modified Date
plastic surface-mounted package; 2 leads (REV 1.0) PDF (175.0 kB) SOD323F [English]	08 Feb 2016

Packing (1)

Name/Description	Modified Date
Tape reel; standard product orientation 12NC ending 115 (REV 1.0) PDF (180.0 kB) SOD323F_115 [English]	07 Nov 2012

Reliability and Quality Information (2)

Name/Description	Modified Date
BAS16J NXP Product Quality (REV 1.2) PDF (74.0 kB) BAS16J_NXP_PRODUCT_QUALITY [English]	31 Jan 2015
BAS16J NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BAS16J_NXP_PRODUCT_RELIABILITY [English]	31 Jan 2015

Supporting Information (1)

Name/Description	Modified Date
Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English]	30 Sep 2013

Design Support

LSYMDIO_1 (REV 0.1) PDF LSYMDIO_1 5/1/1999

SPICE model

BAS16J SPICE model (REV 1.4) prm BAS16J 7/22/2012

Ordering Information

Product	Status	Package version	Package name	Size (mm)	V_R [max] (V)	V_R max (V)	I_FSM [max] (A)	I_FSM max (A)	V_Fmax (mV)	V_F [max] (mV)	I_R [max] (nA)	I_R max (nA)	I_FRM (mA)	IFRM (mA)	Configuration	t_rr max (ns)	t_rr [max] (ns)	I_F [max] (mA)	I_F max (mA)	C_d [max] (pF)	C_d max. (pF)
BAS16J	Active	SOD323F	SOD323F	1.7 x 1.25 x 0.7	100	100	4	4	1000@IF=50mA	1000@IF=50mA	500@VR=80V	500@VR=80V	500	500	single	4	4	250	250	1.5	1.5
BAS16J/A2	No Longer Manufactured	SOD323F	SOD323F	1.7 x 1.25 x 0.7	100	100	4	4	1000@IF=50mA	1000@IF=50mA	500@VR=80V	500@VR=80V	500	500	single	4	4	250	250	1.5	1.5

Package Information

Product ID	Package Description	Outline Version	Reflow/Wave Soldering	Packing	Product Status	Part NumberOrdering code(12NC)	Marking	Chemical Content	RoHS / Pb Free / RHF	LeadFree Conversion Date	EFR	IFR(FIT)	MTBF(hour)	MSL	MSL LF
BAS16J		SOD323F	Reflow_Soldering_Profile	Reel 11¼" Q1/T1 in LargePack	Active	BAS16J,135 (9340 609 35135)	AR	BAS16J		Always Pb-free	347.0	1.61	6.21E8	1	1
BAS16J		SOD323F	Reflow_Soldering_Profile	Reel 7" Q1/T1	Active	BAS16J,115 (9340 609 35115)	AR	BAS16J		Always Pb-free	347.0	1.61	6.21E8	1	1

High-speed switching diodes BAS16_AUTOMOTIVE

Brushless DC motor control using the LPC2141 BAS16_AUTOMOTIVE

TDA8790M Evaluation board documentation BAS16_AUTOMOTIVE

Create smarter, more efficient white goods; An industry-leading portfolio of cost-effective, power-saving solutions for... PMEG6010CE_AUTOMOTIVE

Discretes Semiconductors Selection Guide 2016 BUK7M12-60E

BAS16J NXP Product Quality BAS16_AUTOMOTIVE

BAS16J NXP® Product Reliability BAS16_AUTOMOTIVE

LSYMDIO_1 BAW56W

BAS16J SPICE model BAS16J

plastic surface-mounted package; 2 leads pesd5v0s1uj

Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20

Tape reel; standard product orientation 12NC ending 115 pesd5v0s1uj

PESD5V0S1UJ_PESD12VS1UJ

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