BAW156: Low-leakage double diode
Epitaxial, medium-speed switching, double diode in a small SOT23 plastic SMD package. The diodes are in common anode configuration.
SOT023
Data Sheets (1)
| Name/Description | Modified Date |
|---|---|
| Low-leakage double diode (REV 3.0) PDF (119.0 kB) BAW156 | 11 May 1999 |
Selector Guides (1)
| Name/Description | Modified Date |
|---|---|
| Discretes Semiconductors Selection Guide 2016 (REV 1.0) PDF (47.9 MB) 75017631 | 17 Feb 2016 |
Package Information (1)
| Name/Description | Modified Date |
|---|---|
| plastic surface-mounted package; 3 leads (REV 1.0) PDF (213.0 kB) SOT23 | 08 Feb 2016 |
Packing (2)
| Name/Description | Modified Date |
|---|---|
| Tape reel SMD; standard product orientation 12NC ending 235 (REV 2.0) PDF (199.0 kB) SOT23_235 | 05 Feb 2013 |
| Tape reel SMD; standard product orientation 12NC ending 215 (REV 1.0) PDF (202.0 kB) SOT23_215 | 16 Nov 2012 |
Reliability and Quality Information (2)
| Name/Description | Modified Date |
|---|---|
| BAW156 NXP Product Quality (REV 1.2) PDF (74.0 kB) BAW156_NXP_PRODUCT_QUALITY | 31 Jan 2015 |
| BAW156 NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BAW156_NXP_PRODUCT_RELIABILITY | 31 Jan 2015 |
Supporting Information (2)
| Name/Description | Modified Date |
|---|---|
| Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE | 30 Sep 2013 |
| Wave Soldering Profile (REV 1.0) PDF (20.0 kB) WAVE_SOLDERING_PROFILE | 30 Sep 2013 |
SPICE model
- BAW156 SPICE model (REV 1.1) prm BAW156_1 7/22/2012
Ordering Information
| Product | Status | Package version | Package name | Size (mm) | VR max (V) | VR [max] (V) | IFSM max (A) | IFSM [max] (A) | VF [max] (mV) | VFmax (mV) | IR max (nA) | IR [max] (nA) | IFRM (mA) | IFRM (mA) | Configuration | trr [max] (ns) | trr max (ns) | IF max (mA) | IF [max] (mA) | Cd [max] (pF) | Cd max. (pF) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| BAW156 | Active | SOT23 | TO-236AB | 2.9 x 1.3 x 1 | 75 | 75 | 4 | 4 | 1000@IF=10mA | 1000@IF=10mA | 5@VR=75V | 5@VR=75V | 500 | 500 | dual c.a. | 3000 | 3000 | 160 | 160 | 3 | 3 |
| BAW156/A2 | No Longer Manufactured | SOT23 | TO-236AB | 2.9 x 1.3 x 1 | 75 | 75 | 4 | 4 | 1000@IF=10mA | 1000@IF=10mA | 5@VR=75V | 5@VR=75V | 500 | 500 | dual c.a. | 3000 | 3000 | 160 | 160 | 3 | 3 |
Package Information
| Product ID | Package Description | Outline Version | Reflow/Wave Soldering | Packing | Product Status | Part NumberOrdering code(12NC) | Marking | Chemical Content | RoHS / Pb Free / RHF | LeadFree Conversion Date | EFR | IFR(FIT) | MTBF(hour) | MSL | MSL LF |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| BAW156 | | SOT23 | Reflow_Soldering_Profile
Wave_Soldering_Profile Reflow_Soldering_Profile Wave_Soldering_Profile | Reel 11" Q3/T4, LargePack | Active | BAW156VL (9340 326 50235) | JZ% | BAW156 |    | Always Pb-free | 347.0 | 1.61 | 6.21E8 | 1 | 1 |
| Reel 7" Q3/T4 | Active | BAW156,215 (9340 326 50215) | JZ% | BAW156 | | week 34, 2003 | 347.0 | 1.61 | 6.21E8 | 1 | 1 |
- Low-leakage double diode BAW156
- Discretes Semiconductors Selection Guide 2016 BUK7M12-60E
- BAW156 NXP Product Quality BAW156
- BAW156 NXP® Product Reliability BAW156
- BAW156 SPICE model BAW156
- plastic surface-mounted package; 3 leads BSS84AK
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- Tape reel SMD; standard product orientation 12NC ending 235 BSS84AK
- Tape reel SMD; standard product orientation 12NC ending 215 BSS84AK
- PMBFJ309
