The PCA85176 is a peripheral device which interfaces to almost any Liquid Crystal Display (LCD) with low multiplex rates. It generates the drive signals for any static or multiplexed LCD containing up to four backplanes and up to 40 segments. It can be easily cascaded for larger LCD applications. The PCA85176 is compatible with most microcontrollers and communicates via the two-line bidirectional I²C-bus. Communication overheads are minimized by a display RAM with auto-incremented addressing, by hardware subaddressing, and by display memory switching (static and duplex drive modes).
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40 x 4 automotive LCD driver for low multiplex rates (REV 6.0) PDF (475.0 kB) PCA85176 | 07 Apr 2015 |
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EMC and system level ESD design guidelines for LCD drivers (REV 1.0) PDF (910.0 kB) AN11267 | 06 Mar 2015 |
Cascading NXP® LCD segment drivers (REV 1.0) PDF (766.0 kB) AN11494 | 06 Mar 2015 |
ESD and EMC sensitivity of IC (REV 1.0) PDF (745.0 kB) AN10853 | 14 Mar 2013 |
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Store and transport requirements (REV 3.0) PDF (325.0 kB) UM10569 | 10 Mar 2015 |
I2C-bus specification and user manual (REV 6.0) PDF (1.4 MB) UM10204 | 28 Apr 2014 |
I2C-bus specification and user manual (REV 5.0) PDF (1.6 MB) UM10204_JA | 03 Apr 2013 |
I2C Demonstration Board 2005-1 Quick Start Guide (REV 1.0) PDF (261.0 kB) UM10206 | 13 Jun 2006 |
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NXP® I2C-bus solutions 2014: Smart, simple solutions for the 12 most common design concerns (REV 1.0) PDF (3.5 MB) 75017540 | 01 Aug 2014 |
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plastic thin quad flat package; 64 leads; body 10 x 10 x 1.0 mm (REV 1.0) PDF (191.0 kB) SOT357-1 | 08 Feb 2016 |
plastic thin shrink small outline package; 56 leads; body width 6.1 mm (REV 1.0) PDF (506.0 kB) SOT364-1 | 08 Feb 2016 |
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TQFP64; Reel dry pack, SMD, 13" Q1/T1 standard product orientation Orderable part number ending, 518 or... (REV 1.0) PDF (197.0 kB) SOT357-1_518 | 29 Sep 2015 |
TSSOP56; Reel pack; SMD, 13" Q1/T1 Standard product orientation Orderable part number ending ,118 or... (REV 4.0) PDF (248.0 kB) SOT364-1_118 | 15 Apr 2013 |
Name/Description | Modified Date |
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Footprint for wave soldering (REV 1.0) PDF (12.0 kB) QFP-SQFP-TQFP-WAVE | 08 Oct 2009 |
Footprint for wave soldering (REV 1.0) PDF (16.0 kB) SSOP-TSSOP-VSO-WAVE | 08 Oct 2009 |
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Product ID | Package Description | Outline Version | Reflow/Wave Soldering | Packing | Product Status | Part NumberOrdering code(12NC) | Marking | Chemical Content | RoHS / Pb Free / RHF | LeadFree Conversion Date | IFR(FIT) | MTBF(hour) | MSL | MSL LF |
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PCA85176H/Q900/1 | SOT357-1 | QFP-SQFP-TQFP-WAVE | Reel 13" Q1/T1 in Drypack | Active | PCA85176H/Q900/1,5 (9352 900 65518) | PCA85176H | PCA85176H/Q900/1 | Always Pb-free | 5 | 2E8 | 2 | 2 | ||
PCA85176T/Q900/1 | SOT364-1 | SSOP-TSSOP-VSO-WAVE | Reel 13" Q1/T1 | Active | PCA85176T/Q900/1,1 (9352 900 76118) | PCA85176T | PCA85176T/Q900/1 | Always Pb-free | 5 | 2E8 | 1 | 1 |