PESD18VF1BL: Ultra low capacitance bidirectional ESD protection diode
Ultra low capacitance bidirectional ElectroStatic Discharge (ESD) protection diode in a DFN1006-2 (SOD882) leadless ultra small Surface-Mounted Device (SMD) plastic package designed to protect one signal line from the damage caused by ESD and other transients.
sod882_3d
Data Sheets (1)
| Name/Description | Modified Date |
|---|---|
| Ultra low capacitance bidirectional ESD protection diode (REV 1.0) PDF (711.0 kB) PESD18VF1BL [English] | 03 Sep 2013 |
Brochures (4)
| Name/Description | Modified Date |
|---|---|
| Application guide: ESD protection (REV 1.0) PDF (11.5 MB) 75017664 [English] | 03 Jul 2015 |
| High-performance, small form-factor devices protect the NFC antenna (REV 1.0) PDF (1.2 MB) 75017519 [English] | 29 Jan 2014 |
| 适用于便携设备和移动电话... (REV 1.0) PDF (4.9 MB) 939775017444_ZH [English] | 28 Oct 2013 |
| Discretes for portable devices and mobile handsets (REV 1.1) PDF (3.9 MB) 939775017444 [English] | 04 Sep 2013 |
Package Information (1)
| Name/Description | Modified Date |
|---|---|
| DFN1006-2: leadless ultra small plastic package; 2 terminals (REV 1.0) PDF (174.0 kB) SOD882 [English] | 08 Feb 2016 |
Packing (1)
| Name/Description | Modified Date |
|---|---|
| Tape reel SMD; standard product orientation 12NC ending 315 (REV 1.0) PDF (240.0 kB) SOD882_315 [English] | 07 Nov 2012 |
Reliability and Quality Information (2)
| Name/Description | Modified Date |
|---|---|
| PESD18VF1BL NXP® Product Reliability (REV 1.1) PDF (83.0 kB) PESD18VF1BL_1 [English] | 31 Jan 2015 |
| PESD18VF1BL NXP® Product Quality (REV 1.1) PDF (74.0 kB) PESD18VF1BL_NXP_PRODUCT_QUALITY [English] | 31 Jan 2015 |
Supporting Information (1)
| Name/Description | Modified Date |
|---|---|
| Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English] | 30 Sep 2013 |
SPICE model
- PESD18VF1BL SPICE model (REV 1.0) TXT PESD18VF1BL_1_2 5/10/2016
Ordering Information
| Product | Status | Package version | Package name | Size (mm) | No of protected lines | Configuration | Cd [typ] (pF) | VRWM (V) | VESD IEC61000-4-2 (kV) | IRM [max] (µA) | Cd [max] (pF) |
|---|---|---|---|---|---|---|---|---|---|---|---|
| PESD18VF1BL | Active | SOD882 | DFN1006-2 | 1.0 x 0.6 x 0.5 | 1 | Bidirectional | 0.35 | 18 | 10 | 0.03 | 0.5 |
Package Information
| Product ID | Package Description | Outline Version | Reflow/Wave Soldering | Packing | Product Status | Part NumberOrdering code(12NC) | Marking | Chemical Content | RoHS / Pb Free / RHF | LeadFree Conversion Date | EFR | IFR(FIT) | MTBF(hour) | MSL | MSL LF |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| PESD18VF1BL | | SOD882 | Reflow_Soldering_Profile | Reel 7" Q1/T1 Pitch 2mm | Active | PESD18VF1BLYL (9340 676 02315) | WM | PESD18VF1BL |    | Always Pb-free | 244.0 | 1.13 | 8.85E8 | 1 | 1 |
- Application guide: ESD protection prtr5v0u2x
- High-performance, small form-factor devices protect the NFC antenna PESD24VF1BL
- 适用于便携设备和移动电话... ptvsxs1ur_automotive
- Discretes for portable devices and mobile handsets ptvsxs1ur_automotive
- PESD18VF1BL NXP® Product Reliability PESD18VF1BL
- PESD18VF1BL NXP® Product Quality PESD18VF1BL
- PESD18VF1BL SPICE model PESD18VF1BL
- DFN1006-2: leadless ultra small plastic package; 2 terminals pesd9x7.0l
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- Tape reel SMD; standard product orientation 12NC ending 315 pesd9x7.0l
- 1PS10SB82
