Planar Maximum Efficiency General Application (MEGA) Schottky barrier diode with an integrated guard ring for stress protection in a SOT666 ultra small SMD plastic package.
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Low VF MEGA Schottky barrier diode (REV 2.0) PDF (100.0 kB) PMEG2010EV | 20 Aug 2003 |
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Philips BISS loadswitch solutions and the SOT666 BISS loadswitch demo board (REV 1.0) PDF (260.0 kB) AN10361 | 20 Jun 2005 |
The PMEG1020EA and PMEG2010EA MEGA Schottky diodes (REV 1.0) PDF (130.0 kB) AN10230 | 07 Apr 2003 |
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Discretes Semiconductors Selection Guide 2016 (REV 1.0) PDF (47.9 MB) 75017631 | 17 Feb 2016 |
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plastic surface-mounted package; 6 leads (REV 1.0) PDF (188.0 kB) SOT666 | 08 Feb 2016 |
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Tape reel SMD; standard product orientation 12NC ending 115 (REV 1.0) PDF (178.0 kB) SOT666_115 | 29 Nov 2012 |
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PMEG2010EV NXP® Product Reliability (REV 1.1) PDF (83.0 kB) PMEG2010EV_1 | 31 Jan 2015 |
PMEG2010EV NXP® Product Quality (REV 1.1) PDF (74.0 kB) PMEG2010EV_NXP_PRODUCT_QUALITY | 31 Jan 2015 |
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Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE | 30 Sep 2013 |
Product | Status | Package version | Package name | Size (mm) | IF (A) | VR (V) | Configuration | IR [max] (mA) | IFSM [max] (A) | Cd [max] (pF) | VF [max] (mV) |
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PMEG2010EV | Active | SOT666 | SOT666 | 1.6 x 1.2 x 0.55 | 1 | 20 | single | 0,05@VR=15V | 8 | 25@VR=5V | 550@IF=1A |
Product ID | Package Description | Outline Version | Reflow/Wave Soldering | Packing | Product Status | Part NumberOrdering code(12NC) | Marking | Chemical Content | RoHS / Pb Free / RHF | LeadFree Conversion Date | EFR | IFR(FIT) | MTBF(hour) | MSL | MSL LF |
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PMEG2010EV | SOT666 | Reflow_Soldering_Profile | Reel 7" Q1/T1 | Active | PMEG2010EV,115 (9340 570 99115) | F1 | PMEG2010EV | Always Pb-free | 157.0 | 0.73 | 1.37E9 | 1 | 1 |