Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifier with an integrated guard ring for stress protection, encapsulated in a SOT1061 leadless small Surface-Mounted Device (SMD) plastic package.
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2 A low V_F MEGA Schottky barrier rectifier (REV 1.0) PDF (263.0 kB) PMEG2020EPA | 10 Feb 2010 |
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Leadless Schottky diodes in a DC-to-DC step-up converter (REV 1.1) PDF (562.0 kB) AN11470 | 06 Mar 2015 |
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1 and 2 A Schottky rectifiers in leadless medium-power package; NXP® low VF (MEGA) Schottky rectifier... (REV 1.0) PDF (2.6 MB) 75017425 | 20 Apr 2013 |
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Discretes Semiconductors Selection Guide 2016 (REV 1.0) PDF (47.9 MB) 75017631 | 17 Feb 2016 |
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DFN2020-3: plastic thermal enhanced ultra thin small outline package; no leads; 3 terminals; body 2 x 2 x 0.65 mm (REV 1.0) PDF (185.0 kB) SOT1061 | 08 Feb 2016 |
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DFN2020-3; reel pack; standard product orientation; 12NC ending 115 (REV 1.0) PDF (261.0 kB) SOT1061_115 | 07 Nov 2012 |
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PMEG2020EPA NXP® Product Reliability (REV 1.1) PDF (83.0 kB) PMEG2020EPA_1 | 31 Jan 2015 |
PMEG2020EPA NXP® Product Quality (REV 1.1) PDF (74.0 kB) PMEG2020EPA_NXP_PRODUCT_QUALITY | 31 Jan 2015 |
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Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE | 30 Sep 2013 |
Product | Status | Package version | Package name | Size (mm) | IF (A) | VR (V) | Configuration | IR [max] (mA) | IFSM [max] (A) | Cd [max] (pF) | VF [max] (mV) |
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PMEG2020EPA | Active | SOT1061 | DFN2020-3 | 2 x 2 x 0.65 | 2 | 20 | single | 1,9@VR=20V | 17 | 65@VR=10V | 420@IF=2A |
Product ID | Package Description | Outline Version | Reflow/Wave Soldering | Packing | Product Status | Part NumberOrdering code(12NC) | Marking | Chemical Content | RoHS / Pb Free / RHF | LeadFree Conversion Date | EFR | IFR(FIT) | MTBF(hour) | MSL | MSL LF |
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PMEG2020EPA | SOT1061 | Reflow_Soldering_Profile | Reel 7" Q1/T1 | Active | PMEG2020EPA,115 (9340 642 95115) | AK | PMEG2020EPA | Always Pb-free | 157.0 | 0.73 | 1.37E9 | 1 | 1 |