PMEG3015EH; PMEG3015EJ: 30 V, 1.5 A ultra low VF MEGA Schottky barrier rectifiers
Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifiers with an integrated guard ring for stress protection, encapsulated in small and flat lead SMD plastic packages.
PMEG3015EH_PMEG3015EJ: Product Block Diagram
PMEG3015EH_PMEG3015EJ: Block Diagram
sod123f_3d
Data Sheets (1)
| Name/Description | Modified Date |
|---|---|
| 30 V, 1.5 A ultra low VF MEGA Schottky barrier rectifiers (REV 3.0) PDF (107.0 kB) PMEG3015EH_EJ [English] | 28 Jan 2010 |
Selector Guides (1)
| Name/Description | Modified Date |
|---|---|
| Discretes Semiconductors Selection Guide 2016 (REV 1.0) PDF (47.9 MB) 75017631 [English] | 17 Feb 2016 |
Package Information (2)
| Name/Description | Modified Date |
|---|---|
| plastic surface-mounted package; 2 leads (REV 1.0) PDF (172.0 kB) SOD123F [English] | 08 Feb 2016 |
| plastic surface-mounted package; 2 leads (REV 1.0) PDF (175.0 kB) SOD323F [English] | 08 Feb 2016 |
Packing (2)
| Name/Description | Modified Date |
|---|---|
| Tape reel; standard product orientation 12NC ending 115 (REV 1.0) PDF (183.0 kB) SOD123F_115 [English] | 07 Nov 2012 |
| Tape reel; standard product orientation 12NC ending 115 (REV 1.0) PDF (180.0 kB) SOD323F_115 [English] | 07 Nov 2012 |
Reliability and Quality Information (4)
| Name/Description | Modified Date |
|---|---|
| PMEG3015EH NXP® Product Reliability (REV 1.1) PDF (83.0 kB) PMEG3015EH [English] | 31 Jan 2015 |
| PMEG3015EH NXP® Product Quality (REV 1.1) PDF (74.0 kB) PMEG3015EH_NXP_PRODUCT_QUALITY [English] | 31 Jan 2015 |
| PMEG3015EJ NXP® Product Reliability (REV 1.1) PDF (83.0 kB) PMEG3015EJ [English] | 31 Jan 2015 |
| PMEG3015EJ NXP® Product Quality (REV 1.1) PDF (74.0 kB) PMEG3015EJ_NXP_PRODUCT_QUALITY [English] | 31 Jan 2015 |
Supporting Information (1)
| Name/Description | Modified Date |
|---|---|
| Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English] | 30 Sep 2013 |
SPICE model
- PMEG3015EH SPICE model (REV 1.4) prm PMEG3015EH_1 7/22/2012
- PMEG3015EJ SPICE model (REV 1.4) prm PMEG3015EJ_1 7/22/2012
Ordering Information
| Product | Status |
|---|---|
| PMEG3015EH | Active |
| PMEG3015EJ | Active |
Package Information
| Product ID | Package Description | Outline Version | Reflow/Wave Soldering | Packing | Product Status | Part NumberOrdering code(12NC) | Marking | Chemical Content | RoHS / Pb Free / RHF | LeadFree Conversion Date | EFR | IFR(FIT) | MTBF(hour) | MSL | MSL LF |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| PMEG3015EJ |  | SOD323F | Reflow_Soldering_Profile | Reel 7" Q1/T1 | Active | PMEG3015EJ,115 (9340 590 04115) | EK | PMEG3015EJ |    | Always Pb-free | 157.0 | 0.73 | 1.37E9 | 1 | 1 |
| PMEG3015EH | | SOD123F | Reflow_Soldering_Profile | Reel 7" Q1/T1 | Active | PMEG3015EH,115 (9340 592 77115) | AE | PMEG3015EH | | Always Pb-free | 157.0 | 0.73 | 1.37E9 | 1 | 1 |
- Discretes Semiconductors Selection Guide 2016 BUK7M12-60E
- PMEG3015EH NXP® Product Reliability PMEG3015EH
- PMEG3015EH NXP® Product Quality PMEG3015EH
- PMEG3015EJ NXP® Product Reliability PMEG3015EJ
- PMEG3015EJ NXP® Product Quality PMEG3015EJ
- PMEG3015EH SPICE model PMEG3015EH_PMEG3015EJ
- PMEG3015EJ SPICE model PMEG3015EJ
- PMEG3015EJ PMEG3015EH_PMEG3015EJ
- plastic surface-mounted package; 2 leads pesd5v0s1uj
- Tape reel; standard product orientation 12NC ending 115 pesd5v0s1uj
- PMEG3015EH PMEG3015EH_PMEG3015EJ
- plastic surface-mounted package; 2 leads BAT54H
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- Tape reel; standard product orientation 12NC ending 115 BAT54H
- 1PSXSB17
- 1PSXSB17
- PESD5V0S1UJ_PESD12VS1UJ
- NZH_SERIES
