RB520CS3002L: 200 mA low VF MEGA Schottky barrier rectifier
Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifier with an integrated guard ring for stress protection, encapsulated in DFN1006-2 (SOD882) leadless ultra small Surface-Mounted Device (SMD) plastic package.
sod882_3d
Data Sheets (1)
| Name/Description | Modified Date |
|---|---|
| 200 mA low VF MEGA Schottky barrier rectifier (REV 1.0) PDF (199.0 kB) RB520CS3002L [English] | 25 Jun 2013 |
Selector Guides (1)
| Name/Description | Modified Date |
|---|---|
| Discretes Semiconductors Selection Guide 2016 (REV 1.0) PDF (47.9 MB) 75017631 [English] | 17 Feb 2016 |
Package Information (1)
| Name/Description | Modified Date |
|---|---|
| DFN1006-2: leadless ultra small plastic package; 2 terminals (REV 1.0) PDF (174.0 kB) SOD882 [English] | 08 Feb 2016 |
Packing (1)
| Name/Description | Modified Date |
|---|---|
| Tape reel SMD; standard product orientation 12NC ending 315 (REV 1.0) PDF (240.0 kB) SOD882_315 [English] | 07 Nov 2012 |
Reliability and Quality Information (2)
| Name/Description | Modified Date |
|---|---|
| RB520CS3002L NXP® Product Reliability (REV 1.1) PDF (83.0 kB) RB520CS3002L_1 [English] | 31 Jan 2015 |
| RB520CS3002L NXP Product Quality (REV 1.2) PDF (74.0 kB) RB520CS3002L_NXP_PRODUCT_QUALITY [English] | 31 Jan 2015 |
Supporting Information (1)
| Name/Description | Modified Date |
|---|---|
| Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English] | 30 Sep 2013 |
SPICE model
- RB520CS3002L SPICE model (REV 1.0) TXT RB520CS3002L_1_2 8/14/2013
Ordering Information
| Product | Status | Package version | Package name | Size (mm) | VR [max] (V) | IF [max] (mA) | IFSM [max] (A) | Configuration | VF [max] (mV) | Cd [max] (pF) | IR [max] (mA) | IR [max] (µA) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| RB520CS3002L | Active | SOD882 | DFN1006-2 | 1.0 x 0.6 x 0.5 | 30 | 200 | 3 | single | 640 | 10 | 0.5 |
Package Information
| Product ID | Package Description | Outline Version | Reflow/Wave Soldering | Packing | Product Status | Part NumberOrdering code(12NC) | Marking | Chemical Content | RoHS / Pb Free / RHF | LeadFree Conversion Date | EFR | IFR(FIT) | MTBF(hour) | MSL | MSL LF |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| RB520CS3002L | | SOD882 | Reflow_Soldering_Profile | Reel 7" Q1/T1 Pitch 2mm | Active | RB520CS3002LYL (9340 678 37315) | ZA | RB520CS3002L |    | Always Pb-free | 157.0 | 0.73 | 1.37E9 | 1 | 1 |
- 200 mA low VF MEGA Schottky barrier rectifier RB520CS3002L
- Discretes Semiconductors Selection Guide 2016 BUK7M12-60E
- RB520CS3002L NXP® Product Reliability RB520CS3002L
- RB520CS3002L NXP Product Quality RB520CS3002L
- RB520CS3002L SPICE model RB520CS3002L
- DFN1006-2: leadless ultra small plastic package; 2 terminals pesd9x7.0l
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- Tape reel SMD; standard product orientation 12NC ending 315 pesd9x7.0l
- 1PS10SB82
