SC16IS850L：带有I²C总线/SPI接口、128字节发送和接收FIFO以及IrDA SIR内置式支持的单通道UART
SC16IS850L是一个连接单通道高性能UART的从I²C总线/SPI接口。能提供最大5 Mbit/s的数据速率并保证低工作和睡眠电流。该器件提供极小的HVQFN24和TSSOP24封装，非常适合手持、电池供电应用。还能够从I²C总线或SPI至RS-232/RS-485进行无缝协议转换，并且完全可以双向进行。
SC16IS850L支持最大12 Mbit/s的SPI时钟速度，支持最大115.2 kbit/s的IrDA SIR。其内部寄存器组向后兼容广泛使用且流行的16C850。允许从其他平台轻松写入或导入软件。
SC16IS850L还提供额外的高级功能，如自动硬件和软件流控制、自动RS-485支持和软件复位。允许软件独立于硬件复位信号在任何时候对UART进行复位。
特性和优势
应用
| 产品图片  |
封装与包装
| 型号 | 封装 | Outline version | Reflow-/Wave soldering | 包装 | 产品状态 | 标示 | 可订购的器件编号, (订购码 (12NC)) |
|---|---|---|---|---|---|---|---|
| SC16IS850LIBS |  HVQFN24 (SOT616-3) | sot616-3_po | sot616-3_fr | Reel 13" Q2/T3 | 量产 | 850 | SC16IS850LIBS,128( 9352 933 94128 ) |
| Tray, Bakeable, Multiple | 量产 | 850 | SC16IS850LIBS,157( 9352 933 94157 ) | ||||
| Tray, Bakeable, Single | 量产 | 850 | SC16IS850LIBS,151( 9352 933 94151 ) | ||||
| SC16IS850LIPW |  TSSOP24 (SOT355-1) | sot355-1_po | sot355-1_fr SSOP-TSSOP-VSO-WAVE | Reel 13" Q1/T1 | 量产 | 16IS850L | SC16IS850LIPW,118( 9352 933 95118 ) |
停产信息
| 型号 | 订购码 (12NC) | 最后一次购买日期 | 最后一次交货日期 | 替代产品 |
|---|---|---|---|---|
| SC16IS850LIPW | 935293395128 | |||
| SC16IS850LIPW | 935293395112 |
无铅环保信息
| 型号 | 可订购的器件编号 | RoHS / RHF | 无铅转换日期 | EFR | IFR (FIT) | MTBF（小时） | 潮湿敏感度等级 | MSL LF |
|---|---|---|---|---|---|---|---|---|
| SC16IS850LIBS | SC16IS850LIBS,128 |   | Always Pb-free | 0.0 | 4.0 | 2.5E8 | 1 | 1 |
| SC16IS850LIBS | SC16IS850LIBS,157 | | Always Pb-free | 0.0 | 4.0 | 2.5E8 | 1 | 1 |
| SC16IS850LIBS | SC16IS850LIBS,151 | | Always Pb-free | 0.0 | 4.0 | 2.5E8 | 1 | 1 |
| SC16IS850LIPW | SC16IS850LIPW,118 | | Always Pb-free | 0.0 | 4.0 | 2.5E8 | 1 | 1 |
文档资料
| 档案名称 | 标题 | 类型 | 格式 | 日期 |
|---|---|---|---|---|
| SC16IS850L (中文) | Single UART with I2C-bus/SPI interface, 128 bytes of transmit and receive FIFOs, IrDA SIR built-in support | Data sheet | 2012-07-18 | |
| sot616-3_po | plastic thermal enhanced very thin quad flat package; no leads; 24 terminals; body 4 x 4 x 0.85 mm | Outline drawing | 2005-03-09 | |
| sot616-3_fr | sot616-3_fr | Reflow soldering | 2015-03-03 | |
| SOT616-3_118 | HVQFN24; Reel pack; SMD, 13" Q1/T1 Standard product orientation Orderable part number ending ,118 or J Ordering code (12NC) ending 118 | Packing | 2013-04-16 | |
| SOT616-3_128 | HVQFN24; Reel pack; SMD, 13" Q2/T3 Turned product orientation Orderable part number ending ,128 or HP Ordering code (12NC) ending 128 | Packing | 2014-03-26 | |
| SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 | |
| sot355-1_po | plastic thin shrink small outline package; 24 leads; body width 4.4 mm | Outline drawing | 2009-10-08 | |
| sot355-1_fr | Footprint for reflow soldering SOT355-1 | Reflow soldering | 2009-10-08 | |
| SOT355-1_118 | TSSOP24; Reel pack; SMD, 13" Q1/T1 Standard product orientation Orderable part number ending ,118 or J Ordering code (12NC) ending 118 | Packing | 2013-04-15 |
订购信息
| 型号 | 订购码 (12NC) | 可订购的器件编号 |
|---|---|---|
| SC16IS850LIBS | 9352 933 94128 | SC16IS850LIBS,128 |
| SC16IS850LIBS | 9352 933 94157 | SC16IS850LIBS,157 |
| SC16IS850LIBS | 9352 933 94151 | SC16IS850LIBS,151 |
| SC16IS850LIPW | 9352 933 95118 | SC16IS850LIPW,118 |
- plastic thermal enhanced very thin quad flat package; no leads; 24 terminals; body 4 x 4 x 0.85 mm BGX7101HN
- sot616-3_fr BGX7101HN
- Reel 13" Q1/T1 LPC1112FHN24
- HVQFN24; Reel pack; SMD, 13" Q2/T3 Turned product orientation Orderable part number ending ,128 or HP... PTN36241BBS
- SSOP-TSSOP-VSO-WAVE LPC1114FDH28
- plastic thin shrink small outline package; 24 leads; body width 4.4 mm SA639DH
- Footprint for reflow soldering SOT355-1 SA639DH
- TSSOP24; Reel pack; SMD, 13" Q1/T1 Standard product orientation Orderable part number ending ,118 or... 74LVC4245A_Q100
