MC100LVEP111: 2.5 V / 3.3 V 2:1:10 Differential ECL/PECL/HSTL Clock / Data Fanout Buffer

The MC100LVEP111 is a low skew 2:1:10 differential driver, designed with clock distribution in mind, accepting two clock sources into an input multiplexer. The PECL input signals can be either differential or single-ended (if the VBB output is used). HSTL inputs can be used when the LVEP111 is operating under PECL conditions.The LVEP111 specifically guarantees low output-to-output skew.Optimal design, layout, and processing minimize skew within a device and from device to device. To ensure tightest skew, both sides of differential outputs identically terminate into 50 ohms even if only one side is being used. When fewer than all ten pairs are used, identically terminate all the output pairs on the same package side whether used or unused. If no outputs on a single side are used, then leave these outputs open (unterminated). This will maintain minimum output skew. Failure to do this will result in a 10-20 ps loss of skew margin (propagation delay) in the output(s) in use.

Features
  • 85 ps Typical Device-to-Device Skew
  • 20 ps Typical Output-to-Output Skew
  • Jitter Less than 1 ps RMS
  • Additive RMS Phase Jitter: 60fs @156.25MHz, Typical
  • Maximum Frequency >3 Ghz Typical
  • VBB Output
  • 430 ps Typical Propagation Delay
  • The 100 Series Contains Temperature Compensation
  • PECL and HSTL Mode Operating Range: VCC = 2.375 V to 3.8 V with VEE = 0 V
  • NECL Mode Operating Range: VCC = 0 V with VEE = -2.375 V to -3.8 V
  • Open Input Default State
  • LVDS Input Compatible
Applications
  • General purpose clock and data distribution for Networking, ATE and Computing
Application Notes (16)
Document TitleDocument ID/SizeRevisionRevision Date
A Comparison of LVDS, CMOS, and ECLAND8059/D (34.0kB)0
AC Characteristics of ECL DevicesAND8090/D (896.0kB)1
Clock Generation and Clock and Data Marking and Ordering Information GuideAND8002/D (71kB)12
Designing with PECL (ECL at +5.0 V)AN1406/D (105.0kB)2
ECL Clock Distribution TechniquesAN1405/D (54.0kB)1
ECLinPS Plus™ Spice Modeling KitAND8009/D (343.0kB)11
ECLinPS, ECLinPS Lite, ECLinPS Plus and GigaComm Marking and Ordering Information GuideAND8002 (71kB)12
Interfacing Between LVDS and ECLAN1568/D (121.0kB)11
Interfacing with ECLinPSAND8066/D (72kB)3
Odd Number Divide By Counters with 50% Outputs and Synchronous ClocksAND8001/D (90.0kB)0
Phase Lock Loop General OperationsAND8040/D (64.0kB)3
Storage and Handling of Drypack Surface Mount DeviceAND8003/D (49kB)2Mar, 2016
Termination of ECL Logic DevicesAND8020/D (176.0kB)6
The ECL Translator GuideAN1672/D (142.0kB)12
Thermal Analysis and Reliability of WIRE BONDED ECLAND8072/D (119.0kB)5
Using Wire-OR Ties in ECLInPS™ DesignsAN1650/D (1130.0kB)3
Data Sheets (1)
Document TitleDocument ID/SizeRevisionRevision Date
2.5V / 3.3V 2:1:10 Differential ECL/PECL/HSTL Clock DriverMC100LVEP111/D (173kB)23
Simulation Models (4)
Document TitleDocument ID/SizeRevisionRevision Date
ECLinPS Plus SPICE Modeling KitAND8009 (343.0kB)11
IBIS Model for MC100LVEP111FA 2.5VMC100LVEP111FA_25.IBS (15.0kB)3
IBIS Model for MC100LVEP111FA 3.3VMC100LVEP111FA_33.IBS (14.0kB)5
IBIS Model for mc100lvep111fa -3.3VMC100LVEP111FA_-33.IBS (14.0kB)2
Package Drawings (1)
Document TitleDocument ID/SizeRevision
QFN32, 5x5, 0.5P, 3.1x3.1EP488AM (57.4kB)A
Order Information
ProductStatusCompliancePackageMSL*ContainerBudgetary Price/Unit
M100LVEP111FATWGActivePb-free Halide freeLQFP-32Contact BDTIC2Tape and Reel2000Contact BDTIC
MC100LVEP111FAGActivePb-free Halide freeLQFP-32Contact BDTIC2Tray JEDEC250Contact BDTIC
MC100LVEP111FARGActivePb-free Halide freeLQFP-32Contact BDTIC2Tape and Reel2000Contact BDTIC
MC100LVEP111MNGActivePb-free Halide freeQFN-32488AM1Tube74Contact BDTIC
MC100LVEP111MNRGActivePb-free Halide freeQFN-32488AM1Tape and Reel1000Contact BDTIC
Specifications
ProductTypeChannelsInput / Output RatioInput LevelOutput LevelVCC Typ (V)tJitterRMS Typ (ps)tskew(o-o) Max (ps)tpd Typ (ns)tR & tF Max (ps)fmaxClock Typ (MHz)fmaxData Typ (Mbps)
M100LVEP111FATWGBuffer12:1:10ECL LVDS CML HSTLECL2.5 3.30.2250.432553000
MC100LVEP111FAGBuffer12:1:10ECL CML LVDS HSTLECL3.3 2.50.2250.432553000
MC100LVEP111FARGBuffer12:1:10HSTL CML ECL LVDSECL3.3 2.50.2250.432553000
MC100LVEP111MNGBuffer12:1:10HSTL CML LVDS ECLECL3.3 2.50.2250.432553000
MC100LVEP111MNRGBuffer12:1:10LVDS ECL HSTL CMLECL2.5 3.30.2250.432553000
2.5V / 3.3V 2:1:10 Differential ECL/PECL/HSTL Clock Driver (173kB) MC100LVEP111
A Comparison of LVDS, CMOS, and ECL MC100LVEP111
AC Characteristics of ECL Devices NB100LVEP91
Clock Generation and Clock and Data Marking and Ordering Information Guide NB100LVEP91
Designing with PECL (ECL at +5.0 V) NB100LVEP91
ECL Clock Distribution Techniques NB100LVEP91
ECLinPS Plus™ Spice Modeling Kit MC10EPT20
ECLinPS, ECLinPS Lite, ECLinPS Plus and GigaComm Marking and Ordering Information Guide NB100LVEP91
Interfacing Between LVDS and ECL NB100ELT23L
Interfacing with ECLinPS NB100LVEP91
Odd Number Divide By Counters with 50% Outputs and Synchronous Clocks NUP4201
Phase Lock Loop General Operations MC10H604
Storage and Handling of Drypack Surface Mount Device NB3U23C
Termination of ECL Logic Devices NB100LVEP91
The ECL Translator Guide NB100LVEP91
Thermal Analysis and Reliability of WIRE BONDED ECL NB100LVEP91
Using Wire-OR Ties in ECLInPS™ Designs MC10H351
ECLinPS Plus SPICE Modeling Kit NB4N840M
IBIS Model for MC100LVEP111FA 2.5V MC100LVEP111
IBIS Model for MC100LVEP111FA 3.3V MC100LVEP111
IBIS Model for mc100lvep111fa -3.3V MC100LVEP111
QFN32, 5x5, 0.5P, 3.1x3.1EP NCN6804