HA1631D01T.pdf |
Pin Assignment |
Dimensions |
Star Product | - |
---|---|
Process | CMOS |
Ch. | Dual |
Single Supply (V) min. | 1.8 |
Single Supply (V) max. | 5.5 |
Input Offset Voltage Vio (±mV) max. | 5 |
Supply Current Icc/Idd (mA) max. | 0.005 |
Response Time TPLH (μs) typ. | 1.2 |
Response Time TPHL (μs) typ. | 0.55 |
Operating Temperature Topr (°C) min. | -40 |
Operating Temperature Topr (°C) max. | 85 |
Output Current Io Sink (mA) typ. | 14 |
Output Current Io Source (mA) typ. | 13 |
Package Type | TSSOP |
Production Status | Non-promotion |
Name | TSSOP |
---|---|
JEITA code | P-TSSOP8-4.4x3-0.65 |
Previous code | TTP-8DAV |
Renesas code | PTSP0008JC-B |
Terminal count | 8 |
Terminal pitch (mm) | 0.65 mm |
Dimensions (mm) | 4.4x3 |
Mass (g) [TYP,] | 0.034 |
Drawing Link | ptsp0008jc_b |
Mount pad | fig0004e |
Terminal material - Base | Cu alloy |
Terminal material - Surface | Ni/Pd/Au |
ContainerTape No dry pack | tape-ND |
---|---|
Tape Complete dry pack | tape-D |
Tape | tape2119;tape2025 |
Part Number | Production Status | Product Longevity Program (PLP) | 1000 Piece Budgetary Price | Remarks | Star Produc | RoHS |
---|---|---|---|---|---|---|
HA1631D01TEL-E | Non-promotion | Mar, 2030 | | MOQ:3000| WRAP_SPEC:Embossed Tape| OTHER_ENV: | false | RoHS |