Part Name | Order | Program Memory (KB) | RAM (KB) | Operating Voltage Min (V) |
---|---|---|---|---|
UPD70F3825GB-GAH-AX | contact | 256.0 | 24.0 | 2.85 |
UPD70F3824GB-GAH-AX | contact | 256.0 | 24.0 | 2.85 |
UPD70F3823GB-GAH-AX | contact | 128.0 | 24.0 | 2.85 |
UPD70F3822GB-GAH-AX | contact | 64.0 | 24.0 | 2.85 |
UPD70F3821GB-GAH-AX | contact | 32.0 | 16.0 | 2.85 |
UPD70F3820GB-GAH-AX | contact | 16.0 | 8.0 | 2.85 |
UPD70F3819GA-GAM-AX | contact | 256.0 | 24.0 | 2.85 |
UPD70F3818GA-GAM-AX | contact | 256.0 | 24.0 | 2.85 |
UPD70F3817GA-GAM-AX | contact | 128.0 | 24.0 | 2.85 |
UPD70F3816GA-GAM-AX | contact | 64.0 | 24.0 | 2.85 |
UPD70F3815GA-GAM-AX | contact | 32.0 | 16.0 | 2.85 |
UPD70F3814GA-GAM-AX | contact | 16.0 | 8.0 | 2.85 |
UPD70F3771GF-GAT-AX | contact | 256.0 | 40.0 | 2.85 |
UPD70F3770GC-UEU-AX | contact | 256.0 | 40.0 | 2.85 |
UPD70F3767GF-GAT-AX | contact | 512.0 | 56.0 | 2.85 |
UPD70F3766GF-GAT-AX | contact | 384.0 | 48.0 | 2.85 |
UPD70F3765GF-GAT-AX | contact | 256.0 | 40.0 | 2.85 |
UPD70F3762GC-UEU-AX | contact | 512.0 | 56.0 | 2.85 |
UPD70F3761GC-UEU-AX | contact | 384.0 | 48.0 | 2.85 |
UPD70F3760GC-UEU-AX | contact | 256.0 | 40.0 | 2.85 |
UPD70F3819K8-5B4-AX | contact | 256.0 | 24.0 | 2.85 |
UPD70F3818K8-5B4-AX | contact | 256.0 | 24.0 | 2.85 |
UPD70F3817K8-5B4-AX | contact | 128.0 | 24.0 | 2.85 |
UPD70F3816K8-5B4-AX | contact | 64.0 | 24.0 | 2.85 |
UPD70F3815K8-5B4-AX | contact | 32.0 | 16.0 | 2.85 |
UPD70F3814K8-5B4-AX | contact | 16.0 | 8.0 | 2.85 |
UPD70F3813K8-4B4-AX | contact | 256.0 | 24.0 | 2.85 |
UPD70F3812K8-4B4-AX | contact | 128.0 | 24.0 | 2.85 |
UPD70F3811K8-4B4-AX | contact | 64.0 | 24.0 | 2.85 |
UPD70F3810K8-4B4-AX | contact | 32.0 | 16.0 | 2.85 |
UPD70F3809K8-4B4-AX | contact | 16.0 | 8.0 | 2.85 |
The new 32-bit V850ES/Jx3-H MCUs execute USB 2.0 data transfers at full speeds up to 12 megabits per second (Mbps), and enable rapid development of applications that require USB connectivity and 32-bit processing power for real-time control of industrial equipment, factory automation systems, point-of-sales terminals, medical and testing devices, telecommunications and consumer electronics products and other embedded applications.