SFN NiCr Thin Film, Top-Contact Resistor
Features
- Wire bondable
- Chip size: 0.020" square
- Case: 0202
Datasheet
Packaging Information
- Waffle Pack Packaging - Vishay Electro-Films Waffle Pack Quantity Per Product Family
Product Literature
- Product Overview - Wire Bondable Passive Components Product Family
- Selector Guide - Military and Aerospace Applications
- SFN 61025
- Waffle Pack Packaging 61095
- Product Overview 61046
- Selector Guide 60033
- SFN NiCr Thin Film, Top-Contact Resistor 61025
