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Si8409DB P-Channel 30 V (D-S) MOSFET

Datasheet

• Si8409DB

General Information

• General Information - Useful Web Links

Markings

• Part Marking Information - MICRO FOOT®

Package Drawings

• Package Information - MICRO FOOT: 4-Bumps (1.6 mm x 1.6 mm, 0.8 mm Pitch, 0.290 mm Bump Height)

Pad Guidelines

• PAD Pattern - MICRO FOOT Products

RC Thermal Models

• Si8409DB-RC - RC Thermal Model for Si8409DB

Reel Info

• Reel Information - Reel

Reliability Data

• Package Reliability - Environmental and Package Testing Data for MICRO FOOT®
• Silicon Technology Reliability - P-Channel Accelerated Operating Life Test Result

Tape Info

• PACK-0023-1 - Device Orientation for MOSFETs, MICRO FOOT 2x2: 0.8-mm Pitch, 0.275-mm Bump Height (T1)
• Tape Information - MICRO FOOT® 2 x 2: 0.8 mm PITCH, 0.275 mm BUMP HEIGHT (Si8401DB-T1, Si8402DB-T1, Si8405DB-T1, and Si8411DB-T1)

SPICE Models (*.pdf)

• Si8409DB-DS - DS-Spice Model for Si8409DB

HSPICE Models (*.txt)

• si8409db-h - H-Spice Model for Si8409DB

PSpice Models (*.lib)

• si8409db-p lib - LIB for P-Spice Model for Si8409DB

PSpice Models (*.olb)

• si8409db-p olb - OLB for P-Spice Model for Si8409DB

PSpice Models (*.txt)

• si8409db-p - P-Spice Model for Si8409DB