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Si5517DU N- and P-Channel 20-V (D-S) MOSFET

Datasheet

• Si5517DU

General Information

• General Information - Useful Web Links

Markings

• PART MARKING - 1206-8 ChipFET and PowerPAK ChipFET

Package Drawings

• Package Information - PowerPAK® ChipFET® Case Outline

Pad Guidelines

• Application Note 826 - RECOMMENDED minimum pads FOR PowerPAK® ChipFET® Dual

RC Thermal Models

• si5517du-rc - RC Thermal Model for Si5517DU

Reel Info

• Reel Information - Reel

Reliability Data

• Package Reliability - Environmental and Package Testing Data for PowerPAK® ChipFET®
• Silicon Technology Reliability - N-Channel Accelerated Operating Life Test Result
• Silicon Technology Reliability - P-Channel Accelerated Operating Life Test Result

Tape Info

• PACK-0007-13 - Device Orientation for 1206-8 ChipFET (T1)
• Tape Information - PowerPAK® ChipFET®

SPICE Models (*.pdf)

• Si5517DU-DS - DS-Spice Model for Si5517DU

HSPICE Models (*.txt)

• si5517du-h - H-Spice Model for Si5517DU

PSpice Models (*.lib)

• si5517du-p lib - LIB for P-Spice Model for Si5517DU

PSpice Models (*.olb)

• si5517du-p olb - OLB for P-Spice Model for Si5517DU

PSpice Models (*.txt)

• si5517du-p - P-Spice Model for Si5517DU