数据手册：DS21Q352, DS21Q354, DS21Q552, DS21Q554 .pdf [英文Rev.1(PDF,176kB)]

{状况：生产中。}

The quad T1 and E1 transceiver MCMs offer a high density packaging arrangement for the DS21352/DS21552 T1 single-chip transceivers and the DS21354/DS21554 E1 single-chip transceivers. Four silicon die of one of these devices is packaged in a multi-chip module (MCM) with the electrical connections as shown in Figure 1 in the data sheet. All of the functions available on the DS21352/DS21552 and DS21354/DS21554 are also available in the MCM packaged version however in order to minimize package size, some signals have been deleted. These differences are detailed in table 1 in the data sheet. This data sheet describes the electrical connections and the mechanical dimensions only. Please see the DS21352/DS21552 and DS21354/DS21554 data sheets for full details on all of the features and the operating characteristics of the device.

产品关键特性
  • Four completely independent T1 or E1 transceivers in one small 27mm x 27mm package
  • Each transceiver contains a short and long haul line interface plus a full featured framer with alarm detection/generation, elastic-stores, hardware based signaling support, per DS0 channel control and HDLC controller
  • Each multi-chip module (MCM) contains four die of
    • DS21352 (DS21Q352)
    • DS21552 (DS21Q552)
    • DS21354 (DS21Q354)
    • DS21554 (DS21Q554)
  • See the specific DS21352/DS21552 and DS21354/DS21554 data sheets for details on their feature set and operation
  • All four T1 or E1 transceivers can be concatenated into a single 8.192MHz backplane data stream
  • IEEE 1149.1 JTAG-Boundary Scan architecture
  • DS21Q352/DS21Q552 and DS21Q354/DS21Q554 are pin compatible to allow the same footprint to support T1 and E1 applications
  • 256-pin MCM BGA package (27mm X 27mm)
  • Low power 5V CMOS or low power 3.3V CMOS with 5V tolerant input and outputs
原理图

芯片订购型号
订购型号产品状态封装形式工作温度RoHS/无铅
DS21Q352生产中PBGA；256引脚；729mm²封装信息0°C至+70°C
DS21Q352B生产中PBGA；256引脚；729mm²封装信息0°C至+70°C
DS21Q352B+生产中PBGA；256引脚；729mm²封装信息0°C至+70°C
DS21Q352DK生产中DS21458DKN/A；封装信息0°C至+70°C
DS21Q352N生产中PBGA；256引脚；729mm²封装信息-40°C至+85°C
DS21Q354生产中PBGA；256引脚；729mm²封装信息0°C至+70°C
DS21Q354B生产中PBGA；256引脚；729mm²封装信息0°C至+70°C
DS21Q354B+生产中PBGA；256引脚；729mm²封装信息0°C至+70°C
DS21Q354BN生产中PBGA；256引脚；729mm²封装信息-40°C至+85°C
DS21Q354BN+生产中PBGA；256引脚；729mm²封装信息-40°C至+85°C
DS21Q354C1生产中PBGA；256引脚；729mm²封装信息0°C至+70°C
DS21Q354C1+生产中PBGA；256引脚；729mm²封装信息0°C至+70°C
DS21Q354DK生产中DS21458DKN/A；封装信息0°C至+70°C
DS21Q552生产中PBGA；256引脚；729mm²封装信息0°C至+70°C
DS21Q552+生产中PBGA；256引脚；729mm²封装信息0°C至+70°C
DS21Q552BN生产中PBGA；256引脚；729mm²封装信息-40°C至+85°C
DS21Q552BN+生产中PBGA；256引脚；729mm²封装信息-40°C至+85°C
DS21Q552N生产中PBGA；256引脚；729mm²封装信息-40°C至+85°C
DS21Q552N+生产中PBGA；256引脚；729mm²封装信息-40°C至+85°C
DS21Q554生产中PBGA；256引脚；729mm²封装信息0°C至+70°C
DS21Q554B生产中PBGA；256引脚；729mm²封装信息0°C至+70°C
DS21Q554B+生产中PBGA；256引脚；729mm²封装信息0°C至+70°C
DS21Q554BW生产中PBGA；256引脚；729mm²封装信息0°C至+70°C
DS21Q554N生产中PBGA；256引脚；729mm²封装信息-40°C至+85°C
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DS21Q352, DS21Q354, DS21Q552, DS21Q554 : 四路T1/E1收发器(3.3V, 5.0V) DS21Q352
DS21Q352, DS21Q354, DS21Q552, DS21Q554 : 四路T1/E1收发器(3.3V, 5.0V) DS21Q354
DS21Q352, DS21Q354, DS21Q552, DS21Q554 : 四路T1/E1收发器(3.3V, 5.0V) DS21Q552
DS21Q352, DS21Q354, DS21Q552, DS21Q554 : 四路T1/E1收发器(3.3V, 5.0V) DS21Q554
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