74HCU04: 六位元反相器

74HCU04是六位元非缓冲反相器。输入包括钳位二极管。其能使用限流电阻将输入连接到高于VCC的电压。

Outline 3d SOT337-1
数据手册 (1)
名称/描述Modified Date
Hex unbuffered inverter (REV 7.0) PDF (219.0 kB) 74HCU04 [English]08 Dec 2015
应用说明 (2)
名称/描述Modified Date
Live Insertion Aspects of Philips Logic Families (REV 1.0) PDF (73.0 kB) AN252 [English]13 Mar 2013
Pin FMEA 74HC/74HCT family (REV 1.0) PDF (51.0 kB) AN11044 [English]16 Mar 2011
用户指南 (1)
名称/描述Modified Date
HC/T User Guide (REV 1.0) PDF (508.0 kB) HCT_USER_GUIDE [English]01 Nov 1997
封装信息 (4)
名称/描述Modified Date
plastic small outline package; 14 leads; body width 3.9 mm (REV 1.0) PDF (166.0 kB) SOT108-1 [English]08 Feb 2016
plastic shrink small outline package; 14 leads; body width 5.3 mm (REV 1.0) PDF (295.0 kB) SOT337-1 [English]08 Feb 2016
plastic thin shrink small outline package; 14 leads; body width 4.4 mm (REV 1.0) PDF (285.0 kB) SOT402-1 [English]08 Feb 2016
plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads; 14 terminals; body 2.5 x 3 x... (REV 1.0) PDF (187.0 kB) SOT762-1 [English]08 Feb 2016
包装 (3)
名称/描述Modified Date
Standard product orientation 12NC ending 115 (REV 3.0) PDF (108.0 kB) SOT762-1_115 [English]09 Apr 2013
TSSOP14; Reel pack; SMD, 13" Q1/T1 Standard product orientation Orderable part number ending ,118 or... (REV 1.0) PDF (217.0 kB) SOT402-1_118 [English]08 Apr 2013
Standard product orientation 12NC ending 118 (REV 1.0) PDF (86.0 kB) SOT337-1_118 [English]04 Apr 2013
支持信息 (4)
名称/描述Modified Date
Footprint for reflow soldering (REV 1.0) PDF (9.0 kB) SO-SOJ-REFLOW [English]08 Oct 2009
Footprint for wave soldering (REV 1.0) PDF (8.0 kB) SO-SOJ-WAVE [English]08 Oct 2009
Footprint for reflow soldering (REV 1.0) PDF (16.0 kB) SSOP-TSSOP-VSO-REFLOW [English]08 Oct 2009
Footprint for wave soldering (REV 1.0) PDF (16.0 kB) SSOP-TSSOP-VSO-WAVE [English]08 Oct 2009
IBIS
SPICE
订购信息
型号状态
74HCU04BQActive
74HCU04PWActive
74HCU04DBActive
74HCU04DActive
封装环保信息
产品编号封装说明Outline Version回流/波峰焊接包装产品状态部件编号订购码 (12NC)Marking化学成分RoHS / 无铅 / RHF无铅转换日期EFRIFR(FIT)MTBF(小时)MSLMSL LF
74HCU04PWSOT402-1SSOP-TSSOP-VSO-WAVEReel 13" Q1/T1Active74HCU04PW,118 (9351 875 80118)HCU0474HCU04PWweek 10, 200584.96.621.51E811
Bulk PackActive74HCU04PW,112 (9351 875 80112)HCU0474HCU04PWweek 10, 200584.96.621.51E811
74HCU04BQSOT762-1Reel 7" Q1/T1Active74HCU04BQ,115 (9352 936 42115)HCU0474HCU04BQAlways Pb-free84.96.621.51E811
74HCU04DBSOT337-1SSOP-TSSOP-VSO-REFLOW SSOP-TSSOP-VSO-WAVE
SSOP-TSSOP-VSO-REFLOW SSOP-TSSOP-VSO-WAVE
Reel 13" Q1/T1Active74HCU04DB,118 (9351 752 10118)HCU0474HCU04DBweek 12, 200584.96.621.51E811
Bulk PackActive74HCU04DB,112 (9351 752 10112)HCU0474HCU04DBweek 12, 200584.96.621.51E811
74HCU04DSOT108-1SO-SOJ-REFLOW SO-SOJ-WAVE
SO-SOJ-REFLOW SO-SOJ-WAVE
Reel 13" Q1/T1 CECCActive74HCU04D,653 (9337 140 00653)74HCU04D74HCU04Dweek 30, 200484.96.621.51E811
Bulk Pack, CECCActive74HCU04D,652 (9337 140 00652)74HCU04D74HCU04Dweek 30, 200484.96.621.51E811
Datasheet
Hex unbuffered inverter 74HCU04PW
Other
74hcu04d IBIS model 74HCU04DB
74hcu04pw IBIS model 74HCU04PW
Pin FMEA 74HC/74HCT family 74HC_T_597_Q100
Live Insertion Aspects of Philips Logic Families 74HC_T_245_Q100
hc Spice model 74HCU04PW
HC/T User Guide 74HCU04PW
Footprint for reflow soldering NPIC6C596A_Q100
Footprint for wave soldering NPIC6C596A_Q100
plastic small outline package; 14 leads; body width 3.9 mm 74LV164_Q100
UBA2213
plastic shrink small outline package; 14 leads; body width 5.3 mm 74LVC32A_Q100
Standard product orientation 12NC ending 118 74LVC32A_Q100
74LV164
plastic thin shrink small outline package; 14 leads; body width 4.4 mm 74LV164_Q100
TSSOP14; Reel pack; SMD, 13" Q1/T1 Standard product orientation Orderable part number ending ,118 or... 74LV164_Q100
74LV164
plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads; 14 terminals; body 2.5 x 3 x... 74LV164_Q100
Standard product orientation 12NC ending 115 74LV164_Q100
74LV164
Footprint for reflow soldering 74HC_T_595_Q100
SSOP-TSSOP-VSO-WAVE LPC1114FDH28