BC817DPN: NPN/PNP通用晶体管
NPN/PNP晶体管对，采用SOT457 (SC-74)塑料封装。
BC817DPN: 产品结构框图
SOT457
数据手册 (1)
| 名称/描述 | Modified Date |
|---|---|
| NPN/PNP general purpose transistor (REV 2.0) PDF (149.0 kB) BC817DPN [English] | 22 Nov 2002 |
封装信息 (1)
| 名称/描述 | Modified Date |
|---|---|
| plastic surface-mounted package (TSOP6); 6 leads (REV 1.0) PDF (248.0 kB) SOT457 [English] | 08 Feb 2016 |
包装 (3)
| 名称/描述 | Modified Date |
|---|---|
| TSOP6; Tape reel SMD; standard product orientation 12NC ending 115 (REV 1.0) PDF (187.0 kB) SOT457_115 [English] | 30 Nov 2012 |
| Tape reel SMD; reversed product orientation 12NC ending 125 (REV 1.0) PDF (187.0 kB) SOT457_125 [English] | 30 Nov 2012 |
| Tape reel SMD; standard product orientation 12NC ending 135 (REV 1.0) PDF (187.0 kB) SOT457_135 [English] | 30 Nov 2012 |
可靠性与质量信息 (2)
| 名称/描述 | Modified Date |
|---|---|
| BC817DPN NXP Product Quality (REV 1.2) PDF (74.0 kB) BC817DPN_NXP_PRODUCT_QUALITY [English] | 31 Jan 2015 |
| BC817DPN NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BC817DPN_NXP_PRODUCT_RELIABILITY [English] | 31 Jan 2015 |
支持信息 (3)
| 名称/描述 | Modified Date |
|---|---|
| Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English] | 30 Sep 2013 |
| Wave Soldering Profile (REV 1.0) PDF (20.0 kB) WAVE_SOLDERING_PROFILE [English] | 30 Sep 2013 |
| MAR_SOT457 Topmark (REV 1.0) PDF (113.0 kB) MAR_SOT457 [English] | 03 Jun 2013 |
Design Support
- Letter Symbols - Transistors; General (REV 0.1) PDF LSYMTRA_1 5/7/1999
SPICE
- BC817DPN SPICE model (REV 1.4) prm BC817DPN_1 7/22/2012
订购信息
| 型号 | 状态 | Package version | Package name | 大小 (mm) | hFE min | hFE [min] | Configuration | fT min (MHz) | Ptot (mW) | 说明 | Polarity | IC max (mA) | VCEO max (V) | fr [min] (MHz) | Ptot max (mW) | IC [max] (mA) | Ptot [max] (mW) | VCEO [max] (V) | fT [min] (MHz) | hFE [max] | hFE max |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| BC817DPN | Active | SOT457 | TSOP6 | 2.9 x 1.5 x 1 | 160 | 2 | 600 | NPN/PNP | 500 | 600 | 45 | 80 | 400 |
封装环保信息
| 产品编号 | 封装说明 | Outline Version | 回流/波峰焊接 | 包装 | 产品状态 | 部件编号订购码 (12NC) | Marking | 化学成分 | RoHS / 无铅 / RHF | 无铅转换日期 | EFR | IFR(FIT) | MTBF（小时） | MSL | MSL LF |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| BC817DPN | | SOT457 | Reflow_Soldering_Profile
Wave_Soldering_Profile Reflow_Soldering_Profile Wave_Soldering_Profile | Reel 7" Q3/T4, Reverse | Active | BC817DPN,125 (9340 573 20125) | N4 | BC817DPN |    | Always Pb-free | 153.0 | 0.71 | 1.41E9 | 1 | 1 |
| Reel 7" Q1/T1 | Active | BC817DPN,115 (9340 573 20115) | N4 | BC817DPN | | week 22, 2003 | 153.0 | 0.71 | 1.41E9 | 1 | 1 | ||||
| Reel 11¼" Q1/T1 in LargePack | Active | BC817DPNF (9340 573 20135) | N4 | BC817DPN | 153.0 | 0.71 | 1.41E9 |
- NPN/PNP general purpose transistor BC817DPN
- BC817DPN NXP Product Quality BC817DPN
- BC817DPN NXP® Product Reliability BC817DPN
- MAR_SOT457 Topmark 74LVC2G17_Q100
- Letter Symbols - Transistors; General PEMD16
- BC817DPN SPICE model BC817DPN
- plastic surface-mounted package (TSOP6); 6 leads 74LVC2G17_Q100
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- Tape reel SMD; reversed product orientation 12NC ending 125 74LVC2G17_Q100
- TSOP6; Tape reel SMD; standard product orientation 12NC ending 115 pesd5v0s5ud
- Tape reel SMD; standard product orientation 12NC ending 135 bza456a
- PBSS4240DPN
- SSL5021_SSL5031
