BC817DS: NPN通用双晶体管
NPN晶体管对，采用SOT457 (SC-74)塑料封装。
BC817DS: 产品结构框图
SOT457
数据手册 (1)
| 名称/描述 | Modified Date |
|---|---|
| NPN general purpose double transistor (REV 2.0) PDF (129.0 kB) BC817DS [English] | 22 Nov 2002 |
封装信息 (1)
| 名称/描述 | Modified Date |
|---|---|
| plastic surface-mounted package (TSOP6); 6 leads (REV 1.0) PDF (248.0 kB) SOT457 [English] | 08 Feb 2016 |
包装 (2)
| 名称/描述 | Modified Date |
|---|---|
| TSOP6; Tape reel SMD; standard product orientation 12NC ending 115 (REV 1.0) PDF (187.0 kB) SOT457_115 [English] | 30 Nov 2012 |
| Tape reel SMD; standard product orientation 12NC ending 135 (REV 1.0) PDF (187.0 kB) SOT457_135 [English] | 30 Nov 2012 |
可靠性与质量信息 (2)
| 名称/描述 | Modified Date |
|---|---|
| BC817DS NXP Product Quality (REV 1.2) PDF (74.0 kB) BC817DS_NXP_PRODUCT_QUALITY [English] | 31 Jan 2015 |
| BC817DS NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BC817DS_NXP_PRODUCT_RELIABILITY [English] | 31 Jan 2015 |
支持信息 (3)
| 名称/描述 | Modified Date |
|---|---|
| Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English] | 30 Sep 2013 |
| Wave Soldering Profile (REV 1.0) PDF (20.0 kB) WAVE_SOLDERING_PROFILE [English] | 30 Sep 2013 |
| MAR_SOT457 Topmark (REV 1.0) PDF (113.0 kB) MAR_SOT457 [English] | 03 Jun 2013 |
Design Support
- Letter Symbols - Transistors; General (REV 0.1) PDF LSYMTRA_1 5/7/1999
SPICE
- BC817DS SPICE model (REV 1.4) prm BC817DS_1 7/22/2012
订购信息
| 型号 | 状态 | Package version | Package name | 大小 (mm) | Ptot (mW) | VCEO [max] (V) | Configuration | IC max (mA) | hFE [min] | hFE max | IC [max] (mA) | hFE [max] | fT [min] (MHz) | fr [min] (MHz) | Polarity | Complement |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| BC817DS | Active | SOT457 | TSOP6 | 2.9 x 1.5 x 1 | 600 | 45 | 2 | 160 | 500 | 400 | NPN |
封装环保信息
| 产品编号 | 封装说明 | Outline Version | 回流/波峰焊接 | 包装 | 产品状态 | 部件编号订购码 (12NC) | Marking | 化学成分 | RoHS / 无铅 / RHF | 无铅转换日期 | EFR | IFR(FIT) | MTBF（小时） | MSL | MSL LF |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| BC817DS | | SOT457 | Reflow_Soldering_Profile
Wave_Soldering_Profile Reflow_Soldering_Profile Wave_Soldering_Profile | Reel 11¼" Q1/T1 in LargePack | Active | BC817DSF (9340 573 19135) | N3 | BC817DS |    | Always Pb-free | 153.0 | 0.71 | 1.41E9 | 1 | 1 |
| Reel 7" Q1/T1 | Active | BC817DS,115 (9340 573 19115) | N3 | BC817DS | | week 22, 2003 | 153.0 | 0.71 | 1.41E9 | 1 | 1 |
- BC817DS NXP Product Quality BC817DS
- BC817DS NXP® Product Reliability BC817DS
- MAR_SOT457 Topmark 74LVC2G17_Q100
- Letter Symbols - Transistors; General PEMD16
- BC817DS SPICE model BC817DS
- plastic surface-mounted package (TSOP6); 6 leads 74LVC2G17_Q100
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- Tape reel SMD; standard product orientation 12NC ending 135 bza456a
- TSOP6; Tape reel SMD; standard product orientation 12NC ending 115 pesd5v0s5ud
- BC817DS
- SSL5021_SSL5031
