BC817-25QA; BC817-40QA: 45 V，500 mA NPN通用晶体管
500 mA NPN通用晶体管，采用无引脚超小型DFN1010D-3 (SOT1215)表面贴装器件(SMD)塑料封装，具有可见且可焊的侧焊盘。
sot1215_3d
数据手册 (1)
| 名称/描述 | Modified Date |
|---|---|
| 45 V, 500 mA NPN general-purpose transistors (REV 1.0) PDF (205.0 kB) BC817-25QA_40QA [English] | 03 Sep 2013 |
手册 (1)
| 名称/描述 | Modified Date |
|---|---|
| NXP® MOSFETs and bipolar transistors in DFN1010; Small and Powerful (REV 1.0) PDF (1.8 MB) 75017485 [English] | 04 Nov 2013 |
封装信息 (1)
| 名称/描述 | Modified Date |
|---|---|
| DFN1010D-3: plastic thermal enhanced ultra thin small outline package; no leads; 3 terminals; body 1.1 x 1.0 x 0.37 mm (REV 1.0) PDF (191.0 kB) SOT1215 [English] | 08 Feb 2016 |
可靠性与质量信息 (4)
| 名称/描述 | Modified Date |
|---|---|
| BC817-25QA NXP Product Quality (REV 1.2) PDF (74.0 kB) BC817-25QA_NXP_PRODUCT_QUALITY [English] | 31 Jan 2015 |
| BC817-40QA NXP Product Quality (REV 1.2) PDF (74.0 kB) BC817-40QA_NXP_PRODUCT_QUALITY [English] | 31 Jan 2015 |
| BC817-25QA NXP® Product Reliability (REV 1.0) PDF (87.0 kB) BC817-25QA [English] | 16 Jul 2014 |
| BC817-40QA NXP® Product Reliability (REV 1.0) PDF (87.0 kB) BC817-40QA [English] | 16 Jul 2014 |
支持信息 (1)
| 名称/描述 | Modified Date |
|---|---|
| Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English] | 30 Sep 2013 |
SPICE
- BC817-25QA SPICE model (REV 1.0) TXT BC817-25QA_1 9/6/2013
- BC817-40QA SPICE model (REV 1.0) TXT BC817-40QA_1 9/6/2013
订购信息
| 型号 | 状态 |
|---|---|
| BC817-25QA | Active |
| BC817-40QA | Active |
封装环保信息
| 产品编号 | 封装说明 | Outline Version | 回流/波峰焊接 | 包装 | 产品状态 | 部件编号订购码 (12NC) | Marking | 化学成分 | RoHS / 无铅 / RHF | 无铅转换日期 | EFR | IFR(FIT) | MTBF（小时） | MSL | MSL LF |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| BC817-40QA | | SOT1215 | Reflow_Soldering_Profile | Reel 7" Q2/T3 | Active | BC817-40QAZ (9340 671 58147) | 10 11 00 | BC817-40QA |    | Always Pb-free | 153.0 | 0.71 | 1.41E9 | 1 | 1 |
| Reel 7" Q1/T1 | Withdrawn | BC817-40QAX (9340 671 58115) | 10 11 00 | BC817-40QA | | Always Pb-free | 153.0 | 0.71 | 1.41E9 | 1 | 1 | ||||
| BC817-25QA | | SOT1215 | Reflow_Soldering_Profile | Reel 7" Q2/T3 | Active | BC817-25QAZ (9340 671 56147) | 11 01 00 | BC817-25QA | | Always Pb-free | 153.0 | 0.71 | 1.41E9 | 1 | 1 |
| Reel 7" Q1/T1 | Withdrawn | BC817-25QAX (9340 671 56115) | 11 01 00 | BC817-25QA | | Always Pb-free | 153.0 | 0.71 | 1.41E9 | 1 | 1 |
- 45 V, 500 mA NPN general-purpose transistors BC817-40QA
- NXP® MOSFETs and bipolar transistors in DFN1010; Small and Powerful PBSS5260QA
- BC817-25QA NXP Product Quality BC817-25QA
- BC817-40QA NXP Product Quality BC817-40QA
- BC817-25QA NXP® Product Reliability BC817-25QA
- BC817-40QA NXP® Product Reliability BC817-40QA
- BC817-25QA SPICE model BC817-25QA
- BC817-40QA SPICE model BC817-40QA
- DFN1010D-3: plastic thermal enhanced ultra thin small outline package; no leads; 3 terminals; body 1.1 x 1.0 x 0.37 mm PBSS5260QA
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- LOW_RDSON_MOSFETS_IN_ULTRA_SMALL_DFN1010_SINGLE_AND_DUAL_PACKAGE
