BC859W; BC860W: PNP通用晶体管

PNP晶体管,采用SOT323塑料封装。

NPN补充产品:BC849W和BC850W。

SOT323
数据手册 (1)
名称/描述Modified Date
PNP general purpose transistors (REV 4.0) PDF (123.0 kB) BC859W_860W [English]12 Apr 1999
封装信息 (1)
名称/描述Modified Date
plastic surface-mounted package; 3 leads (REV 1.0) PDF (217.0 kB) SOT323 [English]08 Feb 2016
包装 (2)
名称/描述Modified Date
Tape reel SMD; standard product orientation 12NC ending 115 (REV 1.0) PDF (187.0 kB) SOT323_115 [English]16 Nov 2012
Tape reel SMD; standard product orientation 12NC ending 135 (REV 1.0) PDF (187.0 kB) SOT323_135 [English]16 Nov 2012
可靠性与质量信息 (8)
名称/描述Modified Date
BC859BW NXP Product Quality (REV 1.2) PDF (74.0 kB) BC859BW_NXP_PRODUCT_QUALITY [English]31 Jan 2015
BC859BW NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BC859BW_NXP_PRODUCT_RELIABILITY [English]31 Jan 2015
BC859CW NXP Product Quality (REV 1.2) PDF (74.0 kB) BC859CW_NXP_PRODUCT_QUALITY [English]31 Jan 2015
BC859CW NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BC859CW_NXP_PRODUCT_RELIABILITY [English]31 Jan 2015
BC860BW NXP Product Quality (REV 1.2) PDF (74.0 kB) BC860BW_NXP_PRODUCT_QUALITY [English]31 Jan 2015
BC860BW NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BC860BW_NXP_PRODUCT_RELIABILITY [English]31 Jan 2015
BC860CW NXP Product Quality (REV 1.2) PDF (74.0 kB) BC860CW_NXP_PRODUCT_QUALITY [English]31 Jan 2015
BC860CW NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BC860CW_NXP_PRODUCT_RELIABILITY [English]31 Jan 2015
支持信息 (1)
名称/描述Modified Date
Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English]30 Sep 2013
Design Support
SPICE
订购信息
型号状态
BC859BWActive
BC860CWActive
BC860BWActive
BC859CWActive
封装环保信息
产品编号封装说明Outline Version回流/波峰焊接包装产品状态部件编号订购码 (12NC)Marking化学成分RoHS / 无铅 / RHF无铅转换日期EFRIFR(FIT)MTBF(小时)MSLMSL LF
BC859BWSOT323Reflow_Soldering_ProfileReel 11¼" Q1/T1 in LargePackActiveBC859BW,135 (9340 243 10135)4B%BC859BWweek 30, 2003153.00.711.41E911
Reel 7" Q1/T1ActiveBC859BW,115 (9340 243 10115)4B%BC859BWweek 30, 2003153.00.711.41E911
BC859CWSOT323Reflow_Soldering_ProfileReel 11¼" Q1/T1 in LargePackActiveBC859CW,135 (9340 243 20135)4C%BC859CWweek 30, 2003153.00.711.41E911
Reel 7" Q1/T1ActiveBC859CW,115 (9340 243 20115)4C%BC859CWweek 30, 2003153.00.711.41E911
BC859CW/ZLSOT323Reflow_Soldering_ProfileReel 11¼" Q1/T1 in LargePackActiveBC859CW/ZLF (9340 696 98135)Standard MarkingBC859CW/ZLAlways Pb-free153.00.711.41E911
Reel 7" Q1/T1ActiveBC859CW/ZLX (9340 696 98115)Standard MarkingBC859CW/ZLAlways Pb-free153.00.711.41E911
BC860CWSOT323Reflow_Soldering_ProfileReel 11¼" Q1/T1 in LargePackActiveBC860CW,135 (9340 243 50135)4G%BC860CWweek 30, 2003153.00.711.41E911
Reel 7" Q1/T1ActiveBC860CW,115 (9340 243 50115)4G%BC860CWweek 30, 2003153.00.711.41E911
BC860CW/ZLSOT323Reflow_Soldering_ProfileReel 11¼" Q1/T1 in LargePackActiveBC860CW/ZLF (9340 691 77135)Standard MarkingBC860CW/ZLAlways Pb-free153.00.711.41E911
Reel 7" Q1/T1ActiveBC860CW/ZLX (9340 691 77115)Standard MarkingBC860CW/ZLAlways Pb-free153.00.711.41E911
BC860BWSOT323Reflow_Soldering_ProfileReel 11¼" Q1/T1 in LargePackActiveBC860BW,135 (9340 243 40135)4F%BC860BWweek 30, 2003153.00.711.41E911
Reel 7" Q1/T1ActiveBC860BW,115 (9340 243 40115)4F%BC860BWweek 30, 2003153.00.711.41E911
PNP general purpose transistors BC860CW
BC859BW NXP Product Quality BC859BW
BC859BW NXP® Product Reliability BC859BW
BC859CW NXP Product Quality BC859CW
BC859CW NXP® Product Reliability BC859CW
BC860BW NXP Product Quality BC860BW
BC860BW NXP® Product Reliability BC860BW
BC860CW NXP Product Quality BC860CW
BC860CW NXP® Product Reliability BC860CW
Letter Symbols - Transistors; General PEMD16
BC859BW SPICE model BC859W_BC860W
BC859CW SPICE model BC859W_BC860W
BC860BW SPICE model BC860BW
BC860CW SPICE model BC860CW
plastic surface-mounted package; 3 leads BSS84AKW
Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
Tape reel SMD; standard product orientation 12NC ending 135 BAT854CW
Tape reel SMD; standard product orientation 12NC ending 115 BSS84AKW
PRF947