BCP69, BC869, BC69PA: 20 V，2 A PNP中等功率晶体管
PNP中等功率晶体管系列，采用表面贴装器件(SMD)塑料封装。
SOT089
数据手册 (1)
| 名称/描述 | Modified Date |
|---|---|
| 20 V, 2 A PNP medium power transistors (REV 7.1) PDF (253.0 kB) BCP69_BC869_BC69PA [English] | 20 Oct 2011 |
手册 (1)
| 名称/描述 | Modified Date |
|---|---|
| Medium-power general-purpose transistors (REV 1.0) PDF (892.0 kB) 75017660 [English] | 26 May 2015 |
封装信息 (3)
| 名称/描述 | Modified Date |
|---|---|
| DFN2020-3: plastic thermal enhanced ultra thin small outline package; no leads; 3 terminals; body 2 x 2 x 0.65 mm (REV 1.0) PDF (185.0 kB) SOT1061 [English] | 08 Feb 2016 |
| plastic surface-mounted package with increased heatsink; 4 leads (REV 1.0) PDF (198.0 kB) SOT223 [English] | 08 Feb 2016 |
| plastic surface-mounted package; die pad for good heat transfer; 3 leads (REV 1.0) PDF (193.0 kB) SOT89 [English] | 08 Feb 2016 |
包装 (5)
| 名称/描述 | Modified Date |
|---|---|
| Tape reel SMD; standard product orientation 12NC ending 115 (REV 1.0) PDF (178.0 kB) SOT89_115 [English] | 28 Nov 2012 |
| Tape reel SMD; standard product orientation 12NC ending 135 (REV 1.0) PDF (178.0 kB) SOT89_135 [English] | 28 Nov 2012 |
| DFN2020-3; reel pack; standard product orientation; 12NC ending 115 (REV 1.0) PDF (261.0 kB) SOT1061_115 [English] | 07 Nov 2012 |
| Tape reel SMD; standard product orientation 12NC ending 115 (REV 1.0) PDF (189.0 kB) SOT223_115 [English] | 07 Nov 2012 |
| Tape reel SMD; standard product orientation 12NC ending 135 (REV 1.0) PDF (189.0 kB) SOT223_135 [English] | 07 Nov 2012 |
可靠性与质量信息 (18)
| 名称/描述 | Modified Date |
|---|---|
| BC69-16PA NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BC69-16PA [English] | 31 Jan 2015 |
| BC69-16PA NXP Product Quality (REV 1.2) PDF (74.0 kB) BC69-16PA_NXP_PRODUCT_QUALITY [English] | 31 Jan 2015 |
| BC69-25PA NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BC69-25PA [English] | 31 Jan 2015 |
| BC69-25PA NXP Product Quality (REV 1.2) PDF (74.0 kB) BC69-25PA_NXP_PRODUCT_QUALITY [English] | 31 Jan 2015 |
| BC69PA NXP Product Quality (REV 1.2) PDF (74.0 kB) BC69PA_NXP_PRODUCT_QUALITY [English] | 31 Jan 2015 |
| BC69PA NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BC69PA_NXP_PRODUCT_RELIABILITY [English] | 31 Jan 2015 |
| BC869-16 NXP Product Quality (REV 1.2) PDF (74.0 kB) BC869-16_NXP_PRODUCT_QUALITY [English] | 31 Jan 2015 |
| BC869-16 NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BC869-16_NXP_PRODUCT_RELIABILITY [English] | 31 Jan 2015 |
| BC869-25 NXP Product Quality (REV 1.2) PDF (74.0 kB) BC869-25_NXP_PRODUCT_QUALITY [English] | 31 Jan 2015 |
| BC869-25 NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BC869-25_NXP_PRODUCT_RELIABILITY [English] | 31 Jan 2015 |
| BC869 NXP Product Quality (REV 1.2) PDF (74.0 kB) BC869_NXP_PRODUCT_QUALITY [English] | 31 Jan 2015 |
| BC869 NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BC869_NXP_PRODUCT_RELIABILITY [English] | 31 Jan 2015 |
| BCP69-16 NXP Product Quality (REV 1.2) PDF (74.0 kB) BCP69-16_NXP_PRODUCT_QUALITY [English] | 31 Jan 2015 |
| BCP69-16 NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BCP69-16_NXP_PRODUCT_RELIABILITY [English] | 31 Jan 2015 |
| BCP69-25 NXP Product Quality (REV 1.2) PDF (74.0 kB) BCP69-25_NXP_PRODUCT_QUALITY [English] | 31 Jan 2015 |
| BCP69-25 NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BCP69-25_NXP_PRODUCT_RELIABILITY [English] | 31 Jan 2015 |
| BCP69 NXP Product Quality (REV 1.2) PDF (74.0 kB) BCP69_NXP_PRODUCT_QUALITY [English] | 31 Jan 2015 |
| BCP69 NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BCP69_NXP_PRODUCT_RELIABILITY [English] | 31 Jan 2015 |
支持信息 (2)
| 名称/描述 | Modified Date |
|---|---|
| Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English] | 30 Sep 2013 |
| Wave Soldering Profile (REV 1.0) PDF (20.0 kB) WAVE_SOLDERING_PROFILE [English] | 30 Sep 2013 |
Design Support
- Letter Symbols - Transistors; General (REV 0.1) PDF LSYMTRA_1 5/7/1999
- Power Derating Curves for SMDs; General (REV 0.1) PDF DERATSMD_1 5/7/1999
SPICE
- BC69-16PA SPICE model (REV 1.4) prm BC69-16PA_1 7/22/2012
- BC69-25PA SPICE model (REV 1.4) prm BC69-25PA_1 7/22/2012
- BC69PA SPICE model (REV 1.4) prm BC69PA 7/22/2012
- BC869 SPICE model (REV 1.4) prm BC869 7/22/2012
- BC869-16 SPICE model (REV 1.4) prm BC869-16 7/22/2012
- BC869-25 SPICE model (REV 1.4) prm BC869-25 7/22/2012
- BCP69 SPICE model (REV 1.4) prm BCP69_1 7/22/2012
- BCP69-16 SPICE model (REV 1.4) prm BCP69-16 7/22/2012
- BCP69-25 SPICE model (REV 1.4) prm BCP69-25 7/22/2012
软件
- BCP69_1_2 (REV 0.1) olb BCP69_1_2 11/21/2008
订购信息
| 型号 | 状态 |
|---|---|
| BC869 | Active |
| BCP69-16 | Active |
| BC69PA | Active |
| BC869-25 | Active |
| BCP69 | Active |
| BC69-25PA | Active |
| BC69-16PA | Active |
| BCP69-25 | Active |
| BC869-16 | Active |
封装环保信息
| 产品编号 | 封装说明 | Outline Version | 回流/波峰焊接 | 包装 | 产品状态 | 部件编号订购码 (12NC) | Marking | 化学成分 | RoHS / 无铅 / RHF | 无铅转换日期 | EFR | IFR(FIT) | MTBF（小时） | MSL | MSL LF |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| BC869 | | SOT89 | Reel 11¼" Q1/T1 in LargePack | Active | BC869,135 (9336 787 80135) | CEC | BC869 |    | week 28, 2003 | 153.0 | 0.71 | 1.41E9 | 1 | 1 | |
| Reel 7" Q1/T1 | Active | BC869,115 (9336 787 80115) | CEC | BC869 | | week 28, 2003 | 153.0 | 0.71 | 1.41E9 | 1 | 1 | ||||
| BC69-25PA |  | SOT1061 | Reflow_Soldering_Profile | Reel 7" Q1/T1 | Active | BC69-25PA,115 (9340 658 13115) | BN | BC69-25PA | | Always Pb-free | 153.0 | 0.71 | 1.41E9 | 1 | 1 |
| BC869-25 | | SOT89 | Reel 7" Q1/T1 | Active | BC869-25,115 (9339 753 20115) | CHC | BC869-25 | | week 28, 2003 | 153.0 | 0.71 | 1.41E9 | 1 | 1 | |
| BCP69-16 |  | SOT223 | Reflow_Soldering_Profile
Wave_Soldering_Profile Reflow_Soldering_Profile Wave_Soldering_Profile | Reel 7" Q1/T1 | Active | BCP69-16,115 (9340 094 30115) | BCP69/16 | BCP69-16 | | week 34, 2003 | 153.0 | 0.71 | 1.41E9 | 1 | 1 |
| Reel 11¼" Q1/T1 in LargePack | Active | BCP69-16F (9340 094 30135) | BCP69/16 | BCP69-16 | 153.0 | 0.71 | 1.41E9 | ||||||||
| BCP69-16/ZL | | SOT223 | Reflow_Soldering_Profile
Wave_Soldering_Profile Reflow_Soldering_Profile Wave_Soldering_Profile | Reel 11¼" Q1/T1 in LargePack | Active | BCP69-16/ZLF (9340 707 67135) | Standard Marking | BCP69-16/ZL | 153.0 | 0.71 | 1.41E9 | ||||
| Reel 7" Q1/T1 | Active | BCP69-16/ZLX (9340 707 67115) | Standard Marking | BCP69-16/ZL | 153.0 | 0.71 | 1.41E9 | ||||||||
| BCP69-25 | | SOT223 | Reflow_Soldering_Profile
Wave_Soldering_Profile Reflow_Soldering_Profile Wave_Soldering_Profile | Reel 11¼" Q1/T1 in LargePack | Active | BCP69-25,135 (9339 693 90135) | BCP69/25 | BCP69-25 | | week 34, 2003 | 153.0 | 0.71 | 1.41E9 | 1 | 1 |
| Reel 7" Q1/T1 | Active | BCP69-25,115 (9339 693 90115) | BCP69/25 | BCP69-25 | | week 34, 2003 | 153.0 | 0.71 | 1.41E9 | 1 | 1 | ||||
| BC69-16PA | | SOT1061 | Reflow_Soldering_Profile | Reel 7" Q1/T1 | Active | BC69-16PA,115 (9340 658 12115) | BM | BC69-16PA | | Always Pb-free | 153.0 | 0.71 | 1.41E9 | 1 | 1 |
| BCP69 | | SOT223 | Reflow_Soldering_Profile
Wave_Soldering_Profile Reflow_Soldering_Profile Wave_Soldering_Profile | Reel 11¼" Q1/T1 in LargePack | Active | BCP69,135 (9339 693 80135) | BCP69 | BCP69 | | week 34, 2003 | 153.0 | 0.71 | 1.41E9 | 1 | 1 |
| Reel 7" Q1/T1 | Active | BCP69,115 (9339 693 80115) | BCP69 | BCP69 | | week 34, 2003 | 153.0 | 0.71 | 1.41E9 | 1 | 1 | ||||
| BC869-16 | | SOT89 | Reel 7" Q1/T1 | Active | BC869-16,115 (9340 111 30115) | CGC | BC869-16 | | week 28, 2003 | 153.0 | 0.71 | 1.41E9 | 1 | 1 | |
| BC69PA | | SOT1061 | Reflow_Soldering_Profile | Reel 7" Q1/T1 | Active | BC69PA,115 (9340 657 48115) | B3 | BC69PA | | Always Pb-free | 153.0 | 0.71 | 1.41E9 | 1 | 1 |
- Medium-power general-purpose transistors BSR43
- BC69-16PA NXP® Product Reliability BC69-16PA
- BC69-16PA NXP Product Quality BC69-16PA
- BC69-25PA NXP® Product Reliability BC69-25PA
- BC69-25PA NXP Product Quality BC69-25PA
- BC69PA NXP Product Quality BC69PA
- BC69PA NXP® Product Reliability BC69PA
- BC869-16 NXP Product Quality BC869-16
- BC869-16 NXP® Product Reliability BC869-16
- BC869-25 NXP Product Quality BC869-25
- BC869-25 NXP® Product Reliability BC869-25
- BC869 NXP Product Quality BC869
- BC869 NXP® Product Reliability BC869
- BCP69-16 NXP Product Quality BCP69-16
- BCP69-16 NXP® Product Reliability BCP69-16
- BCP69-25 NXP Product Quality BCP69-25
- BCP69-25 NXP® Product Reliability BCP69-25
- BCP69 NXP Product Quality BCP69
- BCP69 NXP® Product Reliability BCP69
- Letter Symbols - Transistors; General PEMD16
- Power Derating Curves for SMDs; General BST62
- BC69-16PA SPICE model BCP69_BC869_BC69PA
- BC69-25PA SPICE model BCP69_BC869_BC69PA
- BC69PA SPICE model BCP69_BC869_BC69PA
- BC869 SPICE model BCP69_BC869_BC69PA
- BC869-16 SPICE model BCP69_BC869_BC69PA
- BC869-25 SPICE model BCP69_BC869_BC69PA
- BCP69 SPICE model BCP69_BC869_BC69PA
- BCP69-16 SPICE model BCP69-16
- BCP69-25 SPICE model BCP69-25
- BCP69_1_2 BCP69-25
- Tape reel SMD; standard product orientation 12NC ending 135 BZV49-C4V3
- plastic surface-mounted package with increased heatsink; 4 leads BUK7880-55A
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- Tape reel SMD; standard product orientation 12NC ending 135 BUK7880-55
- Tape reel SMD; standard product orientation 12NC ending 115 BUK7880-55A
- plastic surface-mounted package; die pad for good heat transfer; 3 leads BZV49-C9V1
- Tape reel SMD; standard product orientation 12NC ending 115 BZV49-C9V1
- DFN2020-3: plastic thermal enhanced ultra thin small outline package; no leads; 3 terminals; body 2 x 2 x 0.65 mm PMEG6020EPA
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- DFN2020-3; reel pack; standard product orientation; 12NC ending 115 PMEG6020EPA
- BLT81
- BFU590Q
- PTVSXU1UPA_SERIES
