BGA2012：1900 MHz高线性度低噪声放大器
由具有集成式偏置特性的一个NPN双多晶硅晶体管组成的硅单片微波集成电路(MMIC)放大器。
特性和优势
应用
| 产品图片 |
关键参数
| Symbol | Parameter | Conditions | Min | Typ/Nom | Max | Unit |
|---|---|---|---|---|---|---|
| VCC | supply voltage | 4.5 | V | |||
| ICC | supply current | forced by DC voltage on RF input | 15 | mA | ||
| Ptot | total power dissipation | Tsp ≤ 100 °C | 70 | mW | ||
| ISUP | supply current | VSUP = 3 V | 5 | 7.5 | 10 | mA |
| Gp | power gain | high IP3; stripline = 0 mm; f = 1900 MHz; VSUP = 3 V | 16 | dB | ||
| IP3i | input third-order intercept point | high IP3; stripline = 0.5 mm; f = 1900 MHz; VSUP = 3 V; ISUP = 7 mA | 10 | dBm | ||
| NF | spot noise figure | typical application; ISUP = 7 mA; f = 1900 MHz; VSUP = 3 V | 1.7 | dB |
封装与包装
| 型号 | 封装 | Outline version | Reflow-/Wave soldering | 包装 | 产品状态 | 标示 | 可订购的器件编号, (订购码 (12NC)) |
|---|---|---|---|---|---|---|---|
| BGA2012 |  TSSOP6 (SOT363) | sot363_po | sot363_fr sot363_fw | Reel 7" Q1/T1 | 量产 | A6% | BGA2012,115( 9340 563 66115 ) |
引脚配置信息
| Pin | Symbol | Description | 外形简图 | 图形符号 |
|---|---|---|---|---|
| 1 | RF_IN | radio frequency input |  |  |
| 2 | VC | control voltage | ||
| 3 | VS | supply voltage | ||
| 4 | RF_OUT | radio frequency output | ||
| 5 | GND | ground | ||
| 6 | GND | ground |
无铅环保信息
| 型号 | 可订购的器件编号 | RoHS / RHF | 无铅转换日期 | 潮湿敏感度等级 | MSL LF |
|---|---|---|---|---|---|
| BGA2012 | BGA2012,115 |   | week 23, 2003 | NA | NA |
文档资料
| 档案名称 | 标题 | 类型 | 格式 | 日期 |
|---|---|---|---|---|
| BGA2012 (中文) | 1900 MHz high linear low noise amplifier | Data sheet | 2011-03-01 | |
| BGA2012_LNA_18_24GHz | High IP3 MMIC LNA at 1.8-2.4 GHz | Application note | 2001-05-30 | |
| Spar_BGA2012 | S-parameter BGA2012 | S-parameter | zip | 2012-06-06 |
| BGA2012 | BGA2012 SPICE model | SPICE model | prm | 2012-06-08 |
| sot363_fw | Footprint for wave soldering SOT363 | Wave soldering | 2009-10-08 | |
| sot363_po | plastic surface-mounted package; 6 leads | Outline drawing | 2009-10-08 | |
| sot363_fr | Footprint for reflow soldering SOT363 | Reflow soldering | 2010-07-13 | |
| SOT363_115 | TSSOP6; Tape reel SMD; standard product orientation 12NC ending 115 | Packing | 2012-11-15 | |
| MAR_SOT363 | MAR_SOT363 Topmark | Top Marking | 2013-06-03 | |
| Reflow_Soldering_Profile | Reflow Soldering Profile | Reflow soldering | 2013-09-30 | |
| Wave_Soldering_Profile | Wave Soldering Profile | Wave soldering | 2013-09-30 |
订购信息
| 型号 | 订购码 (12NC) | 可订购的器件编号 |
|---|---|---|
| BGA2012 | 9340 563 66115 | BGA2012,115 |
模型
| 标题 | 类型 | 日期 |
|---|---|---|
| S-parameter BGA2012 | S-parameter | 2012-06-06 |
| BGA2012 SPICE model | SPICE model | 2012-06-08 |
- High IP3 MMIC LNA at 1.8-2.4 GHz bga2012
- Footprint for wave soldering SOT363 BFU520Y
- plastic surface-mounted package; 6 leads BFU520Y
- Footprint for reflow soldering SOT363 BFU520Y
- TSSOP6; Tape reel SMD; standard product orientation 12NC ending 115 BSS84AKS
- MAR_SOT363 Topmark BSS84AKS
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- S-parameter BGA2012 BGA2012
- BGA2012 SPICE model BGA2012
