数据手册DataSheet 下载：BLD6G22LS-50 W-CDMA 2110 MHz至2170 MHz的全集成式Doherty晶体管.pdf
BLD6G22L-50和BLD22LS-50结合全集成式Doherty解决方案，采用恩智浦最先进的GEN6 LDMOS技术。该器件非常适合频率范围为2110 MHz至2170 MHz的CDMA基站应用。主器件和峰值器件、输入分离器和输出混合器集成在单个封装中。该封装包括一个栅极和漏极引脚以及两个额外引脚，其中一个用于峰值放大器偏置而另一个未连接。对于常规AB类晶体管，其只需正确的输入/输出匹配和偏置设置。
产品特点
| 产品应用
|
订购型号
| 订购型号 | 封装 | Outline version | Reflow-/Wave soldering | 包装 | 产品状态 | 标示 | 订购器件的编号 |
| BLD6G22LS-50 | CDFM4 (SOT1130B) | sot1130b_po | Bulk Pack | 激活 | Standard Marking | BLD6G22LS-50,112( 9340 635 12112 ) |
品质、可靠性及RoHS化学成分
| 订购型号 | 订购器件的编号 | RoHS / RHF | 无铅开始日期 | EFR | IFR (FIT) | MTBF（小时） | 潮湿敏感度等级 | MSL LF |
| BLD6G22LS-50 | BLD6G22LS-50,112 |   | Always Pb-free | NA | NA |
产品技术资料
| 文档标题 | 类型分类 | 格式 | 更新日期 |
| BLD6G22L-50_BLD6G22LS-50 (中文)：W-CDMA 2110 MHz to 2170 MHz fully integrated Doherty transistor | Data sheet | 2010-08-17 | |
| AN10896：Mounting and Soldering of RF transistors | Application note | 2012-12-19 | |
| 75017347：Enabling the Mobile Experience | Brochure | 2013-02-05 | |
| fatigue_in_aluminum_bond_wires：Fatigue in aluminum bond wires | Mounting and soldering | 2009-10-08 | |
| 75017565：NXP's RF Manual 18th edition | Selection guide | 2014-06-17 | |
| NXP_RFpower_Lib_V08p0：RF Power Model Library for MicroWave Office | Simulation model | zip | 2012-06-08 |
| NXP_RFpower_Library_Manual_MWO_20120420：RF Power Model Library Manual and Installation Instructions for MicroWave Office | Simulation model | 2012-05-22 | |
| NXP_RFPower_Simulation_Example：RF Power Simulation Example for MicroWave Office | Simulation model | zip | 2012-06-11 |
| BLD6G22L-50_ADS-2009_Model：BLD6G22L-50 ADS-2009 Model | Simulation model | zip | 2013-06-11 |
| sot1130b_po：earless flanged ceramic package; 4 leads | Outline drawing | 2010-01-20 |
- Mounting and Soldering of RF transistors aerospace_defense
- Enabling the Mobile Experience rf
- Fatigue in aluminum bond wires gan_devices
- NXP's RF Manual 18th edition OL2300NHN
- RF Power Model Library for MicroWave Office CLF1G0060_S_30
- RF Power Model Library Manual and Installation Instructions for MicroWave Office CLF1G0060_S_30
- RF Power Simulation Example for Microwave Office® CLF1G0060_S_30
- BLD6G22L-50 ADS-2009 Model BLA6G1011_LS_200R_G
- earless flanged ceramic package; 4 leads BLD6G22L_S_50
