数据手册DataSheet 下载：BLF6G22L-40BN 功率LDMOS晶体管.pdf
40 W LDMOS功率晶体管，适合2000 MHz至2200 MHz频率范围的基站应用。
产品特点
| 产品应用
|
订购型号
| 订购型号 | 封装 | Outline version | Reflow-/Wave soldering | 包装 | 产品状态 | 标示 | 订购器件的编号 |
| BLF6G22L-40BN | CDFM6 (SOT1112A) | sot1112a_po | Reel Pack, SMD, 13" Q1/T1 | 激活 | Standard Marking | BLF6G22L-40BN,118( 9340 643 13118 ) |
品质、可靠性及RoHS化学成分
| 订购型号 | 订购器件的编号 | RoHS / RHF | 无铅开始日期 | EFR | IFR (FIT) | MTBF（小时） | 潮湿敏感度等级 | MSL LF |
| BLF6G22L-40BN | BLF6G22L-40BN,118 |   | Always Pb-free | NA | NA | |||
| BLF6G22L-40BN | BLF6G22L-40BN,112 | | Always Pb-free | NA | NA |
产品技术资料
| 文档标题 | 类型分类 | 格式 | 更新日期 |
| BLF6G22L-40BN (中文)：Power LDMOS transistor | Data sheet | 2010-08-30 | |
| AN10896：Mounting and Soldering of RF transistors | Application note | 2012-12-19 | |
| 75017347：Enabling the Mobile Experience | Brochure | 2013-02-05 | |
| PCB_Design_BLF6G22L-40BN_6G22LS-40BN_Data-sheet：PCB Design BLF6G22L(S)-40BN (Data sheet) | Design support | zip | 2012-06-29 |
| fatigue_in_aluminum_bond_wires：Fatigue in aluminum bond wires | Mounting and soldering | 2009-10-08 | |
| 75017565：NXP's RF Manual 18th edition | Selection guide | 2014-06-17 | |
| sot1112a_po：flanged ceramic package; 2 mounting holes; 6 leads | Outline drawing | 2010-04-02 |
- Power LDMOS transistor BLF6G22L-40BN
- Mounting and Soldering of RF transistors aerospace_defense
- Enabling the Mobile Experience rf
- PCB Design BLF6G22L(S)-40BN (Data sheet) BLF6G22LS-40BN
- Fatigue in aluminum bond wires gan_devices
- NXP's RF Manual 18th edition OL2300NHN
- flanged ceramic package; 2 mounting holes; 6 leads BLF6G27L-50BN
