数据手册DataSheet 下载BLF7G27L-150P 功率LDMOS晶体管.pdf

150 W LDMOS功率晶体管,适用于2500 MHz至2700 MHz频率范围的基站应用。

产品特点
  • 主要用于降低记忆效应以提供极佳预失真能力
  • 内部匹配以方便使用
  • 极佳的强度
  • 集成ESD保护
  • 高效率
  • 主要用于宽带操作(2500 MHz至2700 MHz)
  • 低Rth提供极佳的热稳定性
  • 更低的输出电容提升了Doherty应用的性能
  • 符合有害物质限制的Directive 2002/95/EC
产品应用
  • 基站RF功率放大器
  • 2500 MHz 至2700 MHz频率范围内的多载波应用
订购型号
订购型号封装Outline versionReflow-/Wave soldering包装产品状态标示订购器件的编号
BLF7G27L-150P(SOT539A)sot539a_poReel Pack, SMD, 13" Q1/T1激活Standard MarkingBLF7G27L-150P,118( 9340 645 79118 )
品质、可靠性及RoHS化学成分
订购型号订购器件的编号RoHS / RHF无铅开始日期EFRIFR (FIT)MTBF(小时)潮湿敏感度等级MSL LF
BLF7G27L-150PBLF7G27L-150P,118Always Pb-freeNANA
BLF7G27L-150PBLF7G27L-150P,112Always Pb-freeNANA
产品技术资料
文档标题类型分类格式更新日期
BLF7G27L-150P_7G27LS-150P (中文):Power LDMOS transistorData sheetpdf2013-07-12
AN10896:Mounting and Soldering of RF transistorsApplication notepdf2012-12-19
AN10933:2.5 GHz to 2.7 GHz Doherty power amplifier using the BLF7G27LS-150PApplication notepdf2010-08-16
75017347:Enabling the Mobile ExperienceBrochurepdf2013-02-05
PCB_Design_BLF7G27L-150P_7G27LS-150P_AN10933:PCB Design BLF7G27L(S)-150P (AN10933)Design supportzip2012-02-24
fatigue_in_aluminum_bond_wires:Fatigue in aluminum bond wiresMounting and solderingpdf2009-10-08
75017565:NXP's RF Manual 18th editionSelection guidepdf2014-06-17
BLF7G27-150P_ADS-2009_Model:BLF7G27-150P ADS-2009 ModelSimulation modelzip2013-02-28
SOT539A_135:CDFM4; Tape reel SMD; standard product orientation 12NC ending 135Packingpdf2012-12-03
SOT539A_112:CDFM4; blister pack; standard product orientation 12NC ending 112Packingpdf2012-12-03
sot539a_po:flanged balanced ceramic package; 2 mounting holes; 4 leadsOutline drawingpdf2010-04-06
Power LDMOS transistor BLF7G27L_S_150P
Power LDMOS transistor BLF7G27L_S_150P
Power LDMOS transistor BLF7G27L_S_150P
Mounting and Soldering of RF transistors aerospace_defense
2.5 GHz to 2.7 GHz Doherty power amplifier using the BLF7G27LS-150P BLF7G27L_S_150P
Enabling the Mobile Experience rf
PCB Design BLF7G27L(S)-150P (AN10933) BLF7G27L_S_150P
Fatigue in aluminum bond wires gan_devices
NXP's RF Manual 18th edition OL2300NHN
BLF7G27-150P ADS-2009 Model BLF7G27L_S_150P
CDFM4; Tape reel SMD; standard product orientation 12NC ending 135 BLU6H0410L_S_600P
CDFM4; blister pack; standard product orientation 12NC ending 112 BLU6H0410L_S_600P
flanged balanced ceramic package; 2 mounting holes; 4 leads BLU6H0410L_S_600P