数据手册DataSheet 下载：BLF8G10L-160 功率LDMOS晶体管.pdf
160 W LDMOS功率晶体管，适用于920 MHz至960 MHz频率范围的基站应用。
产品特点
| 产品应用
|
订购型号
| 订购型号 | 封装 | Outline version | Reflow-/Wave soldering | 包装 | 产品状态 | 标示 | 订购器件的编号 |
| BLF8G10L-160 | (SOT502A) | sot502a_po | Reel Pack, SMD, 13" Q1/T1 | 激活 | Standard Marking | BLF8G10L-160,118( 9340 659 07118 ) |
品质、可靠性及RoHS化学成分
| 订购型号 | 订购器件的编号 | RoHS / RHF | 无铅开始日期 | EFR | IFR (FIT) | MTBF（小时） | 潮湿敏感度等级 | MSL LF |
| BLF8G10L-160 | BLF8G10L-160,118 |   | Always Pb-free | NA | NA | |||
| BLF8G10L-160 | BLF8G10L-160,112 | | Always Pb-free | NA | NA |
产品技术资料
| 文档标题 | 类型分类 | 格式 | 更新日期 |
| BLF8G10L-160_8G10LS-160 (中文)：Power LDMOS transistor | Data sheet | 2012-02-16 | |
| AN10896：Mounting and Soldering of RF transistors | Application note | 2012-12-19 | |
| 75017347：Enabling the Mobile Experience | Brochure | 2013-02-05 | |
| PCB_Design_BLF8G10L-160_8G10LS-160_Data-sheet：PCB Design BLF8G10L(S)-160 (Data sheet) | Design support | zip | 2012-02-24 |
| 75017301：Gen8: the next generation of LDMOS RF power for wireless infrastructures | Leaflet | 2012-06-11 | |
| fatigue_in_aluminum_bond_wires：Fatigue in aluminum bond wires | Mounting and soldering | 2009-10-08 | |
| 75017565：NXP's RF Manual 18th edition | Selection guide | 2014-06-17 | |
| BLF8G10LS-160_ADS-2011_Model：BLF8G10LS-160 ADS-2011 Model | Simulation model | zip | 2013-06-11 |
| SOT502A_112：CDFM2; blister pack; standard product orientation 12NC ending 112 | Packing | 2012-11-30 | |
| SOT502A_135：Tape reel SMD; standard product orientation 12NC ending 135 | Packing | 2012-12-03 | |
| sot502a_po：flanged ceramic package; 2 mounting holes; 2 leads | Outline drawing | 2009-10-08 |
- Power LDMOS transistor BLF8G10L_S_160
- Power LDMOS transistor BLF8G10L_S_160
- Power LDMOS transistor BLF8G10L_S_160
- Mounting and Soldering of RF transistors aerospace_defense
- Enabling the Mobile Experience rf
- PCB Design BLF8G10L(S)-160 (Data sheet) BLF8G10L_S_160
- Gen8: the next generation of LDMOS RF power for wireless infrastructures BLP8G10S_45P_G
- Fatigue in aluminum bond wires gan_devices
- NXP's RF Manual 18th edition OL2300NHN
- BLF8G10LS-160 ADS-2011 Model BLF8G10L_S_160
- CDFM2; blister pack; standard product orientation 12NC ending 112 BLS7G2325L-105
- Tape reel SMD; standard product orientation 12NC ending 135 BLS6G3135_S_120
- flanged ceramic package; 2 mounting holes; 2 leads BLS7G2325L-105
