数据手册DataSheet 下载：BLM6G10-30G W-CDMA 860 MHz至960 MHz功率MMIC.pdf
30 W LDMOS 2级功率MMIC，适用于860 MHz至960 MHz频率范围的基站应用。提供鸥翼型表面贴装(SOT822-1)或扁平引脚(SOT834-1)
产品特点
| 产品应用
|
订购型号
| 订购型号 | 封装 | Outline version | Reflow-/Wave soldering | 包装 | 产品状态 | 标示 | 订购器件的编号 |
| BLM6G10-30G | HSOP16 (SOT822-1) | sot822-1_po | sot822-1_fr | Reel Pack, SMD, 13" Q1/T1 | 激活 | Standard Marking | BLM6G10-30G,118( 9340 608 93118 ) |
| BLM6G10-30G | HSOP16 (SOT822-1) | sot822-1_po | sot822-1_fr | Horizontal, Rail Pack | 撤回替代产品 | Standard Marking | BLM6G10-30G,127( 9340 608 93127 ) |
品质、可靠性及RoHS化学成分
| 订购型号 | 订购器件的编号 | RoHS / RHF | 无铅开始日期 | EFR | IFR (FIT) | MTBF（小时） | 潮湿敏感度等级 | MSL LF |
| BLM6G10-30G | BLM6G10-30G,118 |   | 3 | 3 | ||||
| BLM6G10-30G | BLM6G10-30G,127 | |
产品技术资料
| 文档标题 | 类型分类 | 格式 | 更新日期 |
| BLM6G10-30_BLM6G10-30G (中文)：W-CDMA 860 MHz - 960 MHz power MMIC | Data sheet | 2011-03-02 | |
| AN10896：Mounting and Soldering of RF transistors | Application note | 2012-12-19 | |
| 75017347：Enabling the Mobile Experience | Brochure | 2013-02-05 | |
| PCB_Design_BLM6G10-30_BLM6G10-30G_Data-sheet：PCB Design BLM6G10-30(G) (Data sheet) | Design support | zip | 2012-02-24 |
| fatigue_in_aluminum_bond_wires：Fatigue in aluminum bond wires | Mounting and soldering | 2009-10-08 | |
| 75017565：NXP's RF Manual 18th edition | Selection guide | 2014-06-17 | |
| sot822-1_fr：Footprint for reflow soldering SOT822-1 | Reflow soldering | 2009-10-08 | |
| sot822-1_po：plastic, heatsink small outline package; 16 leads | Outline drawing | 2007-02-07 |
- W-CDMA 860 MHz - 960 MHz power MMIC BLM6G10-30
- W-CDMA 860 MHz - 960 MHz power MMIC BLM6G10-30G
- W-CDMA 860 MHz - 960 MHz power MMIC BLM6G10_30_G
- Mounting and Soldering of RF transistors aerospace_defense
- Enabling the Mobile Experience rf
- PCB Design BLM6G10-30(G) (Data sheet) BLM6G10_30_G
- Fatigue in aluminum bond wires gan_devices
- NXP's RF Manual 18th edition OL2300NHN
- Footprint for reflow soldering SOT822-1 BLM6G22_30_G
- plastic, heatsink small outline package; 16 leads BLM6G22_30_G
