数据手册DataSheet 下载：BLS6G3135-120 LDMOS S波段雷达功率晶体管.pdf
120 W LDMOS功率晶体管，主要用于3.1 GHz至3.5 GHz范围的雷达应用。
产品特点
| 产品应用
|
订购型号
| 订购型号 | 封装 | Outline version | Reflow-/Wave soldering | 包装 | 产品状态 | 标示 | 订购器件的编号 |
| BLS6G3135-120 | (SOT502A) | sot502a_po | Blister pack | 激活 | Standard Marking | BLS6G3135-120,112( 9340 600 63112 ) |
品质、可靠性及RoHS化学成分
| 订购型号 | 订购器件的编号 | RoHS / RHF | 无铅开始日期 | EFR | IFR (FIT) | MTBF（小时） | 潮湿敏感度等级 | MSL LF |
| BLS6G3135-120 | BLS6G3135-120,112 |   | Always Pb-free | NA | NA |
产品技术资料
| 文档标题 | 类型分类 | 格式 | 更新日期 |
| BLS6G3135-120_6G3135S-120 (中文)：LDMOS S-Band radar power transistor | Data sheet | 2008-05-29 | |
| AN10896：Mounting and Soldering of RF transistors | Application note | 2012-12-19 | |
| PCB_Design_BLS6G3135-120_6G3135S-120_Data-sheet：PCB Design BLS6G3135(S)-120 (Data sheet) | Design support | zip | 2012-02-24 |
| fatigue_in_aluminum_bond_wires：Fatigue in aluminum bond wires | Mounting and soldering | 2009-10-08 | |
| layout_bls6g3135-120：layout_bls6g3135-120 | Other type | zip | 2009-01-15 |
| 75017565：NXP's RF Manual 18th edition | Selection guide | 2014-06-17 | |
| BLS6G3135-120_ADS-2009_Model：BLS6G3135-120 ADS-2009 Model | Simulation model | zip | 2013-02-28 |
| NXP_RFpower_Lib_V08p0：RF Power Model Library for MicroWave Office | Simulation model | zip | 2012-06-08 |
| NXP_RFpower_Library_Manual_MWO_20120420：RF Power Model Library Manual and Installation Instructions for MicroWave Office | Simulation model | 2012-05-22 | |
| NXP_RFPower_Simulation_Example：RF Power Simulation Example for MicroWave Office | Simulation model | zip | 2012-06-11 |
| SOT502A_112：CDFM2; blister pack; standard product orientation 12NC ending 112 | Packing | 2012-11-30 | |
| SOT502A_135：Tape reel SMD; standard product orientation 12NC ending 135 | Packing | 2012-12-03 | |
| sot502a_po：flanged ceramic package; 2 mounting holes; 2 leads | Outline drawing | 2009-10-08 |
- LDMOS S-Band radar power transistor BLS6G3135_S_120
- LDMOS S-Band radar power transistor BLS6G3135_S_120
- Mounting and Soldering of RF transistors aerospace_defense
- PCB Design BLS6G3135(S)-120 (Data sheet) BLS6G3135_S_120
- Fatigue in aluminum bond wires gan_devices
- layout_bls6g3135-120 BLS6G3135_S_120
- NXP's RF Manual 18th edition OL2300NHN
- BLS6G3135-120 ADS-2009 Model BLS6G3135_S_120
- RF Power Model Library for MicroWave Office CLF1G0060_S_30
- RF Power Model Library Manual and Installation Instructions for MicroWave Office CLF1G0060_S_30
- RF Power Simulation Example for Microwave Office® CLF1G0060_S_30
- CDFM2; blister pack; standard product orientation 12NC ending 112 BLS7G2325L-105
- Tape reel SMD; standard product orientation 12NC ending 135 BLS6G3135_S_120
- flanged ceramic package; 2 mounting holes; 2 leads BLS7G2325L-105
