BLT81: UHF功率晶体管

采用塑料SOT223 SMD封装的NPN硅平面外延晶体管。

SOT223
应用说明 (1)
名称/描述Modified Date
GSM power amplifier for 900MHz at 6V (REV 1.0) PDF (595.0 kB) 900MHZ6 [English]13 Jan 1992
封装信息 (1)
名称/描述Modified Date
plastic surface-mounted package with increased heatsink; 4 leads (REV 1.0) PDF (198.0 kB) SOT223 [English]08 Feb 2016
包装 (1)
名称/描述Modified Date
Tape reel SMD; standard product orientation 12NC ending 115 (REV 1.0) PDF (189.0 kB) SOT223_115 [English]07 Nov 2012
支持信息 (2)
名称/描述Modified Date
Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English]30 Sep 2013
Wave Soldering Profile (REV 1.0) PDF (20.0 kB) WAVE_SOLDERING_PROFILE [English]30 Sep 2013
订购信息
型号状态Package versionPackage nameVCEO [max] (V)IC [max] (mA)Ptot [max] (mW)PolarityGUM [typ] (dB)@f (MHz)@VCE (V)
BLT81ActiveSOT223SC-739.55002000NPN89007.5
封装环保信息
产品编号封装说明Outline Version回流/波峰焊接包装产品状态部件编号订购码 (12NC)Marking化学成分RoHS / 无铅 / RHF无铅转换日期MSLMSL LF
BLT81SOT223Reflow_Soldering_Profile Wave_Soldering_Profile
Reflow_Soldering_Profile Wave_Soldering_Profile
Reel 7" Q1/T1ActiveBLT81,115 (9340 197 90115)BLT81BLT81week 34, 200311
GSM power amplifier for 900MHz at 6V BLT81
plastic surface-mounted package with increased heatsink; 4 leads BUK7880-55A
Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
Tape reel SMD; standard product orientation 12NC ending 115 BUK7880-55A
BLT81