数据手册DataSheet 下载：BSH108 N沟道TrenchMOS逻辑电平FET.pdf
逻辑电平N沟道增强型场效应晶体管(FET)，采用使用TrenchMOS技术的塑料封装。该产品仅设计适合用于计算、通信、消费电子和工业应用。
产品特点
| 产品应用
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订购型号
| 订购型号 | 封装 | Outline version | Reflow-/Wave soldering | 包装 | 产品状态 | 标示 | 订购器件的编号 |
| BSH108 | TO-236AB (SOT23) | sot023_po | Reflow_Soldering_Profile Wave_Soldering_Profile | Tape reel smd | 激活 | %K2 | BSH108,215( 9340 555 71215 ) |
品质、可靠性及RoHS化学成分
| 订购型号 | 订购器件的编号 | RoHS / RHF | 无铅开始日期 | EFR | IFR (FIT) | MTBF（小时） | 潮湿敏感度等级 | MSL LF |
| BSH108 | BSH108,215 |   | week 35, 2003 | 220.0 | 1.02 | 9.79E8 | 1 | 1 |
产品技术资料
- Power MOSFET single-shot and repetitive avalanche ruggedness rating BUK7M12-60E
- Understanding power MOSFET data sheet parameters BUK7M12-60E
- Failure signature of Electrical Overstress on Power MOSFETs BUK7M12-60E
- Understanding power MOSFET data sheet parameters BUK7K6R8-40E
- Broad small-signal MOSFET portfolio to suit a wide range of applications BSS84AKW
- BSH108 NXP Product Quality BSH108
- BSH108 Spice model BSH108
- Tape reel SMD; standard product orientation 12NC ending 235 BSS84AK
- Tape reel SMD; standard product orientation 12NC ending 185 BAT54S
- Tape reel SMD; standard product orientation 12NC ending 215 BSS84AK
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- Footprint for reflow soldering SOT023 PMBFJ309
- Footprint for wave soldering SOT023 PMBFJ309
- plastic surface-mounted package; 3 leads PMBFJ309
