BSP126 N沟道垂直D-MOS逻辑电平FET _ BDTIC 中国领先电子元器件代理商

逻辑电平N沟道增强型场效应晶体管(FET)，采用使用垂直D-MOS技术的塑料封装。该产品仅设计适合用于计算、通信、消费电子和工业应用。

订购型号	封装	Outline version	Reflow-/Wave soldering	包装	产品状态	标示	订购器件的编号
BSP126	SC-73 (SOT223)	sot223_po	Reflow_Soldering_Profile Wave_Soldering_Profile	Tape reel smd	激活	BSP126	BSP126,135( 9340 005 40135 )

文档标题	类型分类	格式	更新日期
BSP126 (中文)：N-channel enhancement mode vertical D-MOS transistor	Data sheet	pdf	2002-02-19
AN10273：Power MOSFET single-shot and repetitive avalanche ruggedness rating	Application note	pdf	2010-03-17
AN11158：Understanding power MOSFET data sheet parameters	Application note	pdf	2014-02-04
AN11243：Failure signature of Electrical Overstress on Power MOSFETs	Application note	pdf	2012-10-29
AN11158_ZH：Understanding power MOSFET data sheet parameters	Application note	pdf	2013-11-08
75017288：Broad small-signal MOSFET portfolio to suit a wide range of applications	Line card	pdf	2012-08-23
BSP126_NXP_Product_Quality：BSP126 NXP Product Quality	Quality document	pdf	2014-04-22
BSP126_08_03_2012：BSP126.08_03_2012 Spice parameter	S-parameter	lib	2012-04-13
BSP126：BSP126 SPICE model	SPICE model	prm	2012-06-08
SOT223_115：Tape reel SMD; standard product orientation 12NC ending 115	Packing	pdf	2012-11-07
SOT223_135：Tape reel SMD; standard product orientation 12NC ending 135	Packing	pdf	2012-11-07
Reflow_Soldering_Profile：Reflow Soldering Profile	Reflow soldering	pdf	2013-09-30
Wave_Soldering_Profile：Wave Soldering Profile	Wave soldering	pdf	2013-09-30
sot223_fw：Footprint for wave soldering SOT223	Wave soldering	pdf	2010-07-13
sot223_po：plastic surface-mounted package with increased heatsink; 4 leads	Outline drawing	pdf	2009-10-08
sot223_fr：Footprint for reflow soldering SOT223	Reflow soldering	pdf	2009-10-08