BSP89 N沟道垂直D-MOS逻辑电平FET _ BDTIC 中国领先电子元器件代理商

逻辑电平N沟道增强型场效应晶体管(FET)，采用使用垂直D-MOS技术的塑料封装。该产品仅设计适合用于计算、通信、消费电子和工业应用。

订购型号	封装	Outline version	Reflow-/Wave soldering	包装	产品状态	标示	订购器件的编号
BSP89	SC-73 (SOT223)	sot223_po	Reflow_Soldering_Profile Wave_Soldering_Profile	Tape reel smd	激活	BSP89	BSP89,115( 9340 187 50115 )

订购型号	订购器件的编号	RoHS / RHF	无铅开始日期	EFR	IFR (FIT)	MTBF（小时）	潮湿敏感度等级	MSL LF
BSP89	BSP89,115		week 35, 2003	603.0	2.8	3.58E8	1	1

文档标题	类型分类	格式	更新日期
BSP89 (中文)：N-channel enhancement mode vertical D-MOS transistor	Data sheet	pdf	2001-05-18
AN10273：Power MOSFET single-shot and repetitive avalanche ruggedness rating	Application note	pdf	2010-03-17
AN11158：Understanding power MOSFET data sheet parameters	Application note	pdf	2014-02-04
AN11243：Failure signature of Electrical Overstress on Power MOSFETs	Application note	pdf	2012-10-29
AN11158_ZH：Understanding power MOSFET data sheet parameters	Application note	pdf	2013-11-08
75017288：Broad small-signal MOSFET portfolio to suit a wide range of applications	Line card	pdf	2012-08-23
BSP89_NXP_Product_Quality：BSP89 NXP Product Quality	Quality document	pdf	2014-04-22
BSP89_15_02_2012：BSP89.15_02_2012 Spice parameter	S-parameter	lib	2012-04-13
SOT223_115：Tape reel SMD; standard product orientation 12NC ending 115	Packing	pdf	2012-11-07
SOT223_135：Tape reel SMD; standard product orientation 12NC ending 135	Packing	pdf	2012-11-07
Reflow_Soldering_Profile：Reflow Soldering Profile	Reflow soldering	pdf	2013-09-30
Wave_Soldering_Profile：Wave Soldering Profile	Wave soldering	pdf	2013-09-30
sot223_fw：Footprint for wave soldering SOT223	Wave soldering	pdf	2010-07-13
sot223_po：plastic surface-mounted package with increased heatsink; 4 leads	Outline drawing	pdf	2009-10-08
sot223_fr：Footprint for reflow soldering SOT223	Reflow soldering	pdf	2009-10-08