LPC11E00:50 MHz Cortex-M0 MCU,3.3 V单电源(1.8 V至3.6 V),ADC,EEPROM,USART,I2C,SSP

带10 K SRAM和32 KB闪存的LPC11E00是一种多功能解决方案,可实现2 SSP、带智能卡接口的USART和I2C Fm+及54 GPIO引脚的连接性最大化。LPC11E00系列的片内ROM包含一个带API接口的32位除法库算法效率比软件型的除法库高出数倍,并且具有确定性极高的周期时间和更小的闪存代码尺寸。可以简单的使用片上ROM集成的API接口来访问4KB的EEPROM。

特性和优势
    • 速度高达50 MHz
    • 串行外设包括USART、1-2 SSP、I²C (Fm+)
    • 2个16位和2个32位定时器,具备脉宽调制/匹配/捕捉功能
    • 12 MHz内部RC振荡器,全温度/电压范围内精度为1%
    • 上电复位(POR)、多级欠压检测(BOD)
    • 8通道高精度10位ADC,DNL误差:± 1LSB
    • 多达54个GPIO引脚
应用
    • 工业
    • 8位/16位应用
    • 照明控制
    • 玩具
    • 医疗
产品图片
演示板
OM13058
OM13058
OM13062
OM13062
关键参数
型号CoreClock speed [max] (MHz)DMIPSFlash (kB)RAM (kB)EEPROM (kB)GPIOUARTI²CADC channelsADC (bits)TimersTimer (bits)SCTimer / PWMPWMPackage nameTemperature rangeIOHSupply voltage [min] (V)Supply voltage [max] (V)Product statusDemoboard
LPC11E11FHN33Cortex-M05042840.528118102216; 32111HVQFN32-40 °C to +85 °CN1.83.6Production
LPC11E12FBD48Cortex-M05042166140118102216; 32111LQFP48-40 °C to +85 °CN1.83.6Production
LPC11E13FBD48Cortex-M05042248240118102216; 32111LQFP48-40 °C to +85 °CN1.83.6Production
LPC11E14FBD48Cortex-M050423210440118102216; 32111LQFP48-40 °C to +85 °CN1.83.6Production
LPC11E14FBD64Cortex-M050423210454118102216; 32111LQFP64-40 °C to +85 °CN1.83.6Production
LPC11E14FHN33Cortex-M050423210428118102216; 32111HVQFN32-40 °C to +85 °CN1.83.6Production
LPC11E35FHI331HVQFN32Production
LPC11E36FBD64Cortex-M050429612454118102216; 32111LQFP64-40 °C to +85 °CN1.83.6ProductionOM13062
LPC11E36FHN33Cortex-M050429612428118102216; 32111HVQFN32-40 °C to +85 °CN1.83.6ProductionOM13062
LPC11E37FBD48Cortex-M0504212812440118102216; 32111LQFP48-40 °C to +85 °CN1.83.6ProductionOM13062
LPC11E37FBD64Cortex-M0504212812454118102216; 32111LQFP64-40 °C to +85 °CN1.83.6ProductionOM13062
LPC11E37HFBD64Cortex-M0504212810454118102216; 32111LQFP64-40 °C to +85 °CY1.83.6ProductionOM13062
LPC11E66JBD48Cortex-M0+50426412436428122216; 3226LQFP48-40 °C to +105 °CN2.43.6Production
LPC11E67JBD100Cortex-M0+5042128204805212122216; 3226LQFP100-40 °C to +105 °CN2.43.6Production
LPC11E67JBD48Cortex-M0+504212820436428122216; 3226LQFP48-40 °C to +105 °CN2.43.6ProductionOM13058
LPC11E67JBD64Cortex-M0+5042128204504210122216; 3226LQFP64-40 °C to +105 °CN1.83.6Production
LPC11E68JBD100Cortex-M0+5042256364805212122216; 3226LQFP100-40 °C to +105 °CN2.43.6ProductionOM13058
LPC11E68JBD48Cortex-M0+504225636436428122216; 3226LQFP48-40 °C to +105 °CN2.43.6Production
LPC11E68JBD64Cortex-M0+504225636450428102216; 32211LQFP64-40 °C to +85 °CN1.83.6ProductionOM13058
封装与包装
型号封装Outline versionReflow-/Wave soldering包装产品状态标示可订购的器件编号, (订购码 (12NC))
LPC11E11FHN33/101
HVQFN32
(SOT865-3)
sot865-3_posot865-3_frTray, Bakeable, Single in Drypack量产Standard MarkingLPC11E11FHN33/101,( 9352 970 72551 )
LPC11E12FBD48/201
LQFP48
(SOT313-2)
sot313-2_posot313-2_fr
HTQFP-HLQFP-LQFP-MSQFP-WAVE
Tray, Bakeable, Single in Drypack量产Standard MarkingLPC11E12FBD48/201,( 9352 970 74551 )
LPC11E13FBD48/301
LQFP48
(SOT313-2)
sot313-2_posot313-2_fr
HTQFP-HLQFP-LQFP-MSQFP-WAVE
Tray, Bakeable, Single in Drypack量产Standard MarkingLPC11E13FBD48/301,( 9352 970 73551 )
LPC11E14FBD48/401
LQFP48
(SOT313-2)
sot313-2_posot313-2_fr
HTQFP-HLQFP-LQFP-MSQFP-WAVE
Tray, Bakeable, Single in Drypack量产Standard MarkingLPC11E14FBD48/401,( 9352 970 75551 )
LPC11E14FBD64/401
LQFP64
(SOT314-2)
sot314-2_posot314-2_fr
HTQFP-HLQFP-LQFP-MSQFP-WAVE
Tray, Bakeable, Single in Drypack量产Standard MarkingLPC11E14FBD64/401,( 9352 970 76551 )
LPC11E14FHN33/401
HVQFN32
(SOT865-3)
sot865-3_posot865-3_frTray, Bakeable, Single in Drypack量产Standard MarkingLPC11E14FHN33/401,( 9352 970 68551 )
LPC11E35FHI33/501
HVQFN32
(SOT617-3)
sot617-3_posot617-3_frTray, Bakeable, Single in Drypack量产Standard MarkingLPC11E35FHI33/501E( 9353 049 91551 )
LPC11E36FBD64/501
LQFP64
(SOT314-2)
sot314-2_posot314-2_fr
HTQFP-HLQFP-LQFP-MSQFP-WAVE
Tray, Bakeable, Single in Drypack量产Standard MarkingLPC11E36FBD64/501E( 9352 996 78551 )
LPC11E36FHN33/501
HVQFN32
(SOT865-3)
sot865-3_posot865-3_frTray, Bakeable, Single in Drypack量产Standard MarkingLPC11E36FHN33/501E( 9352 996 76551 )
LPC11E37FBD48/501
LQFP48
(SOT313-2)
sot313-2_posot313-2_fr
HTQFP-HLQFP-LQFP-MSQFP-WAVE
Tray, Bakeable, Single in Drypack量产Standard MarkingLPC11E37FBD48/501E( 9352 996 77551 )
LPC11E37FBD64/501
LQFP64
(SOT314-2)
sot314-2_posot314-2_fr
HTQFP-HLQFP-LQFP-MSQFP-WAVE
Tray, Bakeable, Single in Drypack量产Standard MarkingLPC11E37FBD64/501E( 9352 996 79551 )
LPC11E37HFBD64/401
LQFP64
(SOT314-2)
sot314-2_posot314-2_fr
HTQFP-HLQFP-LQFP-MSQFP-WAVE
Tray, Bakeable, Single量产Standard MarkingLPC11E37HFBD64/4QL( 9353 033 06151 )
LPC11E66JBD48
LQFP48
(SOT313-2)
sot313-2_posot313-2_fr
HTQFP-HLQFP-LQFP-MSQFP-WAVE
Tray, Bakeable, Single in Drypack量产Standard MarkingLPC11E66JBD48E( 9353 044 15551 )
LPC11E67JBD100
LQFP100
(SOT407-1)
sot407-1_posot407-1_fr
HTQFP-HLQFP-LQFP-MSQFP-WAVE
Tray, Bakeable, Single in Drypack量产Standard MarkingLPC11E67JBD100E( 9353 044 19551 )
LPC11E67JBD48
LQFP48
(SOT313-2)
sot313-2_posot313-2_fr
HTQFP-HLQFP-LQFP-MSQFP-WAVE
Tray, Bakeable, Single in Drypack量产Standard MarkingLPC11E67JBD48E( 9353 024 95551 )
LPC11E67JBD64
LQFP64
(SOT314-2)
sot314-2_posot314-2_fr
HTQFP-HLQFP-LQFP-MSQFP-WAVE
Tray, Bakeable, Single in Drypack量产Standard MarkingLPC11E67JBD64E( 9353 044 17551 )
LPC11E68JBD100
LQFP100
(SOT407-1)
sot407-1_posot407-1_fr
HTQFP-HLQFP-LQFP-MSQFP-WAVE
Tray, Bakeable, Single in Drypack量产Standard MarkingLPC11E68JBD100E( 9353 025 02551 )
LPC11E68JBD48
LQFP48
(SOT313-2)
sot313-2_posot313-2_fr
HTQFP-HLQFP-LQFP-MSQFP-WAVE
Tray, Bakeable, Single in Drypack量产Standard MarkingLPC11E68JBD48E( 9353 044 16551 )
LPC11E68JBD64
LQFP64
(SOT314-2)
sot314-2_posot314-2_fr
HTQFP-HLQFP-LQFP-MSQFP-WAVE
Tray, Bakeable, Single in Drypack量产Standard MarkingLPC11E68JBD64E( 9353 024 88551 )
停产信息
型号订购码 (12NC)最后一次购买日期最后一次交货日期替代产品
LPC11E37HFBD64935302932151
无铅环保信息
型号可订购的器件编号RoHS / RHF无铅转换日期潮湿敏感度等级MSL LF
LPC11E11FHN33/101LPC11E11FHN33/101,Always Pb-free13
LPC11E12FBD48/201LPC11E12FBD48/201,Always Pb-free13
LPC11E13FBD48/301LPC11E13FBD48/301,Always Pb-free13
LPC11E14FBD48/401LPC11E14FBD48/401,Always Pb-free13
LPC11E14FBD64/401LPC11E14FBD64/401,Always Pb-free13
LPC11E14FHN33/401LPC11E14FHN33/401,Always Pb-free13
LPC11E35FHI33/501LPC11E35FHI33/501EAlways Pb-free33
LPC11E36FBD64/501LPC11E36FBD64/501EAlways Pb-free22
LPC11E36FHN33/501LPC11E36FHN33/501EAlways Pb-free33
LPC11E37FBD48/501LPC11E37FBD48/501EAlways Pb-free33
LPC11E37FBD64/501LPC11E37FBD64/501EAlways Pb-free22
LPC11E37HFBD64/401LPC11E37HFBD64/4QLAlways Pb-free11
LPC11E66JBD48LPC11E66JBD48EAlways Pb-free33
LPC11E67JBD100LPC11E67JBD100EAlways Pb-free33
LPC11E67JBD48LPC11E67JBD48EAlways Pb-free33
LPC11E67JBD64LPC11E67JBD64EAlways Pb-free12
LPC11E68JBD100LPC11E68JBD100EAlways Pb-free33
LPC11E68JBD48LPC11E68JBD48EAlways Pb-free33
LPC11E68JBD64LPC11E68JBD64EAlways Pb-free12
文档资料
档案名称标题类型格式日期
LPC11E3X (中文)32-bit ARM Cortex-M0 microcontroller; up to 128 kB flash; up to 12 kB SRAM and 4 kB EEPROM; USARTData sheetpdf2014-09-11
ES_LPC11E3XErrata sheet LPC11E3xErrata sheetpdf2014-09-18
75017550NXP ARM® Cortex™-M0/M0+ MCUs LPC11E00Leafletpdf2014-03-01
sot865-3_poplastic thermal enhanced very thin quad flat package; no leads; 32 terminals; body 7 x 7 x 0.85 mmOutline drawingpdf2009-02-04
sot865-3_frFootprint for reflow soldering SOT865-3Reflow solderingpdf2009-10-08
sot313-2_frFootprint for reflow soldering SOT313-2Reflow solderingpdf2009-10-08
sot313-2_poplastic low profile quad flat package; 48 leads; body 7 x 7 x 1.4 mmOutline drawingpdf2009-10-08
HTQFP-HLQFP-LQFP-MSQFP-WAVEFootprint for wave solderingWave solderingpdf2009-10-08
SOT313-2_118LQFP48; Reel pack; SMD, 13" Q1/T1 Standard product orientation Orderable part number ending ,118 or J Ordering code (12NC) ending 118Packingpdf2013-04-15
SOT313-2_128LQFP48; Reel pack; SMD, 13", Turned Q2/T3 Standard product orientation Orderable part number ending ,128 or HP Ordering code (12NC) ending 128Packingpdf2013-04-24
HTQFP-HLQFP-LQFP-MSQFP-WAVEFootprint for wave solderingWave solderingpdf2009-10-08
sot407-1_poplastic low profile quad flat package; 100 leads; body 14 x 14 x 1.4 mmOutline drawingpdf2009-10-08
sot407-1_frFootprint for reflow soldering SOT407-1Reflow solderingpdf2009-10-08
sot314-2_frFootprint for reflow soldering SOT314-2Reflow solderingpdf2009-10-08
sot314-2_poplastic low profile quad flat package; 64 leads; body 10 x 10 x 1.4 mmOutline drawingpdf2009-10-08
HTQFP-HLQFP-LQFP-MSQFP-WAVEFootprint for wave solderingWave solderingpdf2009-10-08
SOT314-2_118LQFP64; Reel pack; SMD, 13" Q1/T1 Standard product orientation Orderable part number ending ,118 or J Ordering code (12NC) ending 118Packingpdf2013-04-15
SOT314-2_128LQFP64; Reel pack; SMD, 13", Turned Q2/T3 Standard product orientation Orderable part number ending ,128 or HP Ordering code (12NC) ending 128Packingpdf2013-04-25
SOT617-3_528HVQFN32; Reel dry pack, SMD, 13" Q2/T3 turn product orientation Orderable part number ending, 528 or MP Ordering code (12NC) ending 528Packingpdf2014-07-24
SOT617-3_518HVQFN32; Reel pack; SMD, 13" Q1/T1 Standard product orientation Orderable part number ending ,518 or Y Ordering code (12NC) ending 518Packingpdf2015-04-01
sot617-3_frFootprint for reflow soldering SOT617-3Reflow solderingpdf2009-10-08
sot617-3_poplastic thermal enhanced very thin quad flat package; no leads; 32 terminals; body 5 x 5 x 0.85 mmOutline drawingpdf2002-10-21
SOT617-3_118HVQFN32; Reel pack; SMD, 13" Q1/T1 Standard product orientation Orderable part number ending ,118 or J Ordering code (12NC) ending 118Packingpdf2014-04-02
订购信息
型号订购码 (12NC)可订购的器件编号
LPC11E11FHN33/1019352 970 72551LPC11E11FHN33/101,
LPC11E12FBD48/2019352 970 74551LPC11E12FBD48/201,
LPC11E13FBD48/3019352 970 73551LPC11E13FBD48/301,
LPC11E14FBD48/4019352 970 75551LPC11E14FBD48/401,
LPC11E14FBD64/4019352 970 76551LPC11E14FBD64/401,
LPC11E14FHN33/4019352 970 68551LPC11E14FHN33/401,
LPC11E35FHI33/5019353 049 91551LPC11E35FHI33/501E
LPC11E36FBD64/5019352 996 78551LPC11E36FBD64/501E
LPC11E36FHN33/5019352 996 76551LPC11E36FHN33/501E
LPC11E37FBD48/5019352 996 77551LPC11E37FBD48/501E
LPC11E37FBD64/5019352 996 79551LPC11E37FBD64/501E
LPC11E37HFBD64/4019353 033 06151LPC11E37HFBD64/4QL
LPC11E66JBD489353 044 15551LPC11E66JBD48E
LPC11E67JBD1009353 044 19551LPC11E67JBD100E
LPC11E67JBD489353 024 95551LPC11E67JBD48E
LPC11E67JBD649353 044 17551LPC11E67JBD64E
LPC11E68JBD1009353 025 02551LPC11E68JBD100E
LPC11E68JBD489353 044 16551LPC11E68JBD48E
LPC11E68JBD649353 024 88551LPC11E68JBD64E
32-bit ARM Cortex-M0 microcontroller; up to 128 kB flash; up to 12 kB SRAM and 4 kB EEPROM; USART LPC11E37FBD64
Errata sheet LPC11E3x LPC11E37FBD64
NXP® ARM® Cortex™-M0/M0+ MCUs LPC11E00 LPC11E68JBD64
plastic thermal enhanced very thin quad flat package; no leads; 32 terminals; body 7 x 7 x 0.85 mm NXQ1TXA1
Footprint for reflow soldering SOT865-3 NXQ1TXA1
Footprint for reflow soldering SOT313-2 PCU9656B
plastic low profile quad flat package; 48 leads; body 7 x 7 x 1.4 mm PCU9656B
Reel 13" Q1/T1 LPC1342FBD48
LQFP48; Reel pack; SMD, 13", Turned Q2/T3 Standard product orientation Orderable part number ending ,128 or... SC16C752B
plastic low profile quad flat package; 100 leads; body 14 x 14 x 1.4 mm LPC2925FBD100
Footprint for reflow soldering SOT407-1 LPC2925FBD100
Footprint for reflow soldering SOT314-2 TEF6862HL
plastic low profile quad flat package; 64 leads; body 10 x 10 x 1.4 mm TEF6862HL
HTQFP-HLQFP-LQFP-MSQFP-WAVE LPC54114J256BD64
Reel 13" Q1/T1 LPC11U37FBD64
LQFP64; Reel pack; SMD, 13", Turned Q2/T3 Standard product orientation Orderable part number ending ,128 or... SC16C750B
HVQFN32; Reel dry pack, SMD, 13" Q2/T3 turn product orientation Orderable part number ending, 528 or MP Ordering code... PTN3366BS
Reel 13" Q1/T1 in Drypack LPC11U35FHI33
Footprint for reflow soldering SOT617-3 OL2381AHN
plastic thermal enhanced very thin quad flat package; no leads; 32 terminals; body 5 x 5 x 0.85 mm OL2381AHN
HVQFN32; Reel pack; SMD, 13" Q1/T1 Standard product orientation Orderable part number ending ,118 or J Ordering code... pca8561_automotive