LPC812M101JDH20: 32位ARM Cortex-M0+微控制器;16 kB闪存和4 kB SRAM

LPC812M101FDH20是基于ARM Cortex-M0+的低成本32位MCU,CPU工作频率高达30 MHz。

LPC812M101FDH20的补充外设包括16 kB闪存、4 kB数据存储器、CRC引擎、1个I²C总线接口、3个USART、2个SPI接口、多速率定时器、自唤醒定时器、状态配置定时器、1个比较器、带开关矩阵的功能配置I/O端口、1个输入模式匹配引擎和18个通用I/O针脚。

Outline 3d SOT360-1
数据手册 (1)
名称/描述修改日期
32-bit ARM Cortex-M0+ microcontroller; up to 16 kB flash and 4 kB SRAM (REV 4.5) PDF (786.0 kB) LPC81XM08 Jun 2016
应用说明 (7)
名称/描述修改日期
SCTimer/PWM cookbook (REV 5.0) ZIP (24.9 MB) AN1153822 Mar 2016
IR remote controller/receiver solution for Windows Media Center (REV 1.0) ZIP (739.0 kB) AN1155115 Aug 2014
LPC800 low power modes and wake-up times (REV 2.0) ZIP (6.3 MB) AN1156105 Aug 2014
NXP® Smartphone Quick-Jack Solution (REV 1.1) PDF (917.0 kB) AN1155204 Jun 2014
NXP® Smartphone Quick-Jack Solution (REV 1.0) PDF (897.0 kB) AN11552_ZH26 May 2014
Using the SCTimer/PWM for capacitive touch buttons (REV 1.0) ZIP (1.9 MB) AN1153616 Apr 2014
Using LPC800 In-Application Programming (REV 1.1) ZIP (4.4 MB) AN1138802 Oct 2013
用户指南 (3)
名称/描述修改日期
NXP® Smartphone Quick-Jack Solution quick start guide (REV 1.1) PDF (403.0 kB) UM1081504 Jun 2014
NXP® smartphone Quick-Jack quick start guide (REV 1.0) PDF (609.0 kB) UM10815_ZH28 May 2014
LPC81x User manual (REV 1.6) PDF (1.8 MB) UM1060103 Apr 2014
手册 (1)
名称/描述修改日期
NXP® Smartphone Quick-Jack solution (REV 1.0) PDF (476.0 kB) 7501757120 May 2014
封装信息 (1)
名称/描述修改日期
plastic thin shrink small outline package; 20 leads; body width 4.4 mm (REV 1.0) PDF (304.0 kB) SOT360-108 Feb 2016
包装 (1)
名称/描述修改日期
TSSOP20; Reel pack; SMD, 13" Q1/T1 Standard product orientation Orderable part number ending ,118 or... (REV 4.0) PDF (225.0 kB) SOT360-1_11815 Apr 2013
支持信息 (1)
名称/描述修改日期
Footprint for wave soldering (REV 1.0) PDF (16.0 kB) SSOP-TSSOP-VSO-WAVE08 Oct 2009
软件
订购信息
型号状态内核Clock speed [max] (MHz)DMIPS闪存 (kB)RAM (kB)EEPROM (kB)GPIO以太网USBUSB (speed)USB (type)LCDADC sample rateCANUARTI²CSPII²SADC channelsADC (bits)Comparators定时器Timer (bits)SCTimer / PWMRTCPWMProduct categoryPackage nameTemperature rangeTemperature sensorIOHSupply voltage [min] (V)Supply voltage [max] (V)Demoboard
LPC812M101JDH20ActiveCortex-M0+3028164181.2 Msps312001416; 3214020-LPC800-TSSOP20-40 °C to +105 °CN1.83.6OM13055; OM13069
封装环保信息
产品编号封装说明Outline Version回流/波峰焊接包装产品状态部件编号订购码 (12NC)Marking化学成分RoHS / 无铅 / RHF无铅转换日期MSLMSL LF
LPC812M101JDH20SOT360-1SSOP-TSSOP-VSO-WAVETubeActiveLPC812M101JDH20FP (9353 024 01129)Standard MarkingLPC812M101JDH20Always Pb-free11
Reel 13" Q1/T1ActiveLPC812M101JDH20J (9353 024 01118)Standard MarkingLPC812M101JDH20Always Pb-free11
32-bit ARM Cortex-M0+ microcontroller; up to 16 kB flash and 4 kB SRAM LPC812M101JTB16
32-bit ARM Cortex-M0+ microcontroller; up to 16 kB flash and 4 kB SRAM lpc800
SCTimer/PWM cookbook LPC54114J256UK49
IR remote controller/receiver solution for Windows Media Center LPC1347FHN33
LPC800 low power modes and wake-up times LPC812M101JTB16
NXP® Smartphone Quick-Jack Solution LPC812M101JTB16
NXP® Smartphone Quick-Jack Solution LPC812M101JTB16
Using the SCTimer/PWM for capacitive touch buttons LPC812M101JTB16
Using LPC800 In-Application Programming LPC812M101JDH20
NXP® Smartphone Quick-Jack Solution quick start guide LPC812M101JTB16
NXP® smartphone Quick-Jack quick start guide LPC812M101JTB16
LPC81x User manual LPC812M101JTB16
NXP® Smartphone Quick-Jack solution LPC812M101JDH20
LPC812 Example Code Bundle Keil and IAR LPC812M101JTB16
LPC812 Example Code Bundle LPCXpresso LPC812M101JTB16
Example Code Bundle for LPCXpresso LPC812M101JTB16
SOT360-1 LPC1112FDH20
SSOP-TSSOP-VSO-WAVE LPC1114FDH28
Reel 13" Q1/T1 LPC824M201JDH20
PCA9634