NXP3875Y; NXP3875G: 50 V，150 mA NPN通用晶体管
NPN通用晶体管，采用小型SOT23 (TO-236AB)表面贴装器件(SMD)塑料封装。
SOT023
数据手册 (1)
| 名称/描述 | Modified Date |
|---|---|
| 50 V, 150 mA NPN general-purpose transistors (REV 1.1) PDF (1.0 MB) NXP3875Y_NXP3875G [English] | 12 Dec 2012 |
封装信息 (1)
| 名称/描述 | Modified Date |
|---|---|
| plastic surface-mounted package; 3 leads (REV 1.0) PDF (213.0 kB) SOT23 [English] | 08 Feb 2016 |
包装 (2)
| 名称/描述 | Modified Date |
|---|---|
| Tape reel SMD; standard product orientation 12NC ending 235 (REV 2.0) PDF (199.0 kB) SOT23_235 [English] | 05 Feb 2013 |
| Tape reel SMD; standard product orientation 12NC ending 215 (REV 1.0) PDF (202.0 kB) SOT23_215 [English] | 16 Nov 2012 |
可靠性与质量信息 (4)
| 名称/描述 | Modified Date |
|---|---|
| NXP3875G NXP Product Quality (REV 1.2) PDF (74.0 kB) NXP3875G_NXP_PRODUCT_QUALITY [English] | 31 Jan 2015 |
| NXP®3875G NXP Product Reliability (REV 1.1) PDF (82.0 kB) NXP3875G_NXP_PRODUCT_RELIABILITY [English] | 31 Jan 2015 |
| NXP3875Y NXP Product Quality (REV 1.2) PDF (74.0 kB) NXP3875Y_NXP_PRODUCT_QUALITY [English] | 31 Jan 2015 |
| NXP®3875Y NXP Product Reliability (REV 1.1) PDF (82.0 kB) NXP3875Y_NXP_PRODUCT_RELIABILITY [English] | 31 Jan 2015 |
支持信息 (2)
| 名称/描述 | Modified Date |
|---|---|
| Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English] | 30 Sep 2013 |
| Wave Soldering Profile (REV 1.0) PDF (20.0 kB) WAVE_SOLDERING_PROFILE [English] | 30 Sep 2013 |
SPICE
- NXP3875G SPICE model (REV 1.0) prm NXP3875G 3/22/2013
- NXP3875Y SPICE model (REV 1.0) prm NXP3875Y 3/22/2013
订购信息
| 型号 | 状态 |
|---|---|
| NXP3875G | Active |
| NXP3875Y | Active |
封装环保信息
| 产品编号 | 封装说明 | Outline Version | 回流/波峰焊接 | 包装 | 产品状态 | 部件编号订购码 (12NC) | Marking | 化学成分 | RoHS / 无铅 / RHF | 无铅转换日期 | EFR | IFR(FIT) | MTBF（小时） | MSL | MSL LF |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| NXP3875Y | | SOT23 | Reflow_Soldering_Profile
Wave_Soldering_Profile Reflow_Soldering_Profile Wave_Soldering_Profile | Reel 7" Q3/T4 | Active | NXP3875YR (9340 672 38215) | %JE | NXP3875Y |    | Always Pb-free | 153.0 | 0.71 | 1.41E9 | 1 | 1 |
| Reel 11" Q3/T4, LargePack | Active | NXP3875YVL (9340 672 38235) | %JE | NXP3875Y | | Always Pb-free | 153.0 | 0.71 | 1.41E9 | 1 | 1 | ||||
| NXP3875G | | SOT23 | Reflow_Soldering_Profile
Wave_Soldering_Profile Reflow_Soldering_Profile Wave_Soldering_Profile | Reel 7" Q3/T4 | Active | NXP3875GR (9340 672 39215) | %JF | NXP3875G | | Always Pb-free | 153.0 | 0.71 | 1.41E9 | 1 | 1 |
- NXP3875G NXP Product Quality NXP3875G
- NXP®3875G NXP Product Reliability NXP3875G
- NXP3875Y NXP Product Quality NXP3875Y
- NXP®3875Y NXP Product Reliability NXP3875Y
- NXP3875G SPICE model NXP3875Y_NXP3875G
- NXP3875Y SPICE model NXP3875Y_NXP3875G
- Tape reel SMD; standard product orientation 12NC ending 235 BSS84AK
- plastic surface-mounted package; 3 leads BSS84AK
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- Tape reel SMD; standard product orientation 12NC ending 215 BSS84AK
- PMBFJ309
