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OM13496:Surface Mount to DIP Evaluation Board OM13496

The OM13496 allows one to evaluate small, surface mount devices by breaking out the package leads to 100 mil centers pins, emulating a DIP package. The OM13496 supports the following packages: QSOP16 (SOT519-1), XFBGA16 (SOT1354-1), XQFN16 (SOT1161-1), TSSOP28 (SOT361-1).

特性
  • Easy connection to small surface mount packages
  • Allows evaluation of device that are only available in surface mount packages
  • 100 mil center headers emulate DIP package for easy bread boarding
  • Eliminates costly sockets and custom printed circuit boards
  • Expand the kit with add-on I²C daughter cards
产品图片

Surface Mount to DIP Evaluation Board OM13496

文档资料
档案名称标题类型格式日期
UM10754OM13491, OM13492, OM13493, OM13494, OM13495, OM13496, OM13497 Breakout BoardUser manualpdf2013-10-30
订购信息
型号订购码 (12NC)可订购的器件编号产品状态
OM134969353 020 76598OM13496ULActive
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OM13496
OM13491, OM13492, OM13493, OM13494, OM13495, OM13496, OM13497 Breakout Board nvt4556