PBSS4612PA: 12 V, 6 A NPN low V_CEsat (BISS) transistor
NPN low VCEsat Breakthrough In Small Signal (BISS) transistor, encapsulated in an ultra thin SOT1061 leadless small Surface-Mounted Device (SMD) plastic package with medium power capability.
PNP complement: PBSS5612PA.
Outline 3d SOT1061
数据手册 (1)
| 名称/描述 | Modified Date |
|---|---|
| 12 V, 6 A NPN low V_CEsat (BISS) transistor (REV 1.0) PDF (167.0 kB) PBSS4612PA [English] | 19 May 2010 |
应用说明 (2)
| 名称/描述 | Modified Date |
|---|---|
| Next generation of NXP® low VCEsat transistors: improved technology for discrete semiconductors (REV 3.0) PDF (1.3 MB) AN11045 [English] | 04 Mar 2013 |
| Thermal behavior of small-signal discretes on multilayer PCBs (REV 1.0) PDF (211.0 kB) AN11076 [English] | 12 Jul 2011 |
封装信息 (1)
| 名称/描述 | Modified Date |
|---|---|
| DFN2020-3: plastic thermal enhanced ultra thin small outline package; no leads; 3 terminals; body 2 x 2 x 0.65 mm (REV 1.0) PDF (185.0 kB) SOT1061 [English] | 08 Feb 2016 |
包装 (1)
| 名称/描述 | Modified Date |
|---|---|
| DFN2020-3; reel pack; standard product orientation; 12NC ending 115 (REV 1.0) PDF (261.0 kB) SOT1061_115 [English] | 07 Nov 2012 |
可靠性与质量信息 (1)
| 名称/描述 | Modified Date |
|---|---|
| PBSS4612PA NXP Product Quality (REV 1.2) PDF (74.0 kB) PBSS4612PA_NXP_PRODUCT_QUALITY [English] | 31 Jan 2015 |
支持信息 (1)
| 名称/描述 | Modified Date |
|---|---|
| Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English] | 30 Sep 2013 |
SPICE
- PBSS4612PA SPICE model (REV 1.4) prm PBSS4612PA_1 7/22/2012
订购信息
| 型号 | 状态 | Package version | Package name | 大小 (mm) | transistor polarity | Transistor polarity | number of transistors | Ptot [max] (mW) | VCEO [max] (V) | IC [max] (A) | ICM [max] (A) | hFE [min] | hFE [typ] | fT [min] (MHz) | fT [typ] (MHz) | RCEsat [typ] (mΩ) | RCEsat [max] (mΩ) | VCEsat [max] (mV) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| PBSS4612PA | Active | SOT1061 | DFN2020-3 | 2 x 2 x 0.65 | NPN | 1 | 2100 | 12 | 6 | 7 | 280 | 440 | 50 | 80 | 33 | 46 | 275 |
封装环保信息
| 产品编号 | 封装说明 | Outline Version | 回流/波峰焊接 | 包装 | 产品状态 | 部件编号订购码 (12NC) | Marking | 化学成分 | RoHS / 无铅 / RHF | 无铅转换日期 | EFR | IFR(FIT) | MTBF（小时） | MSL | MSL LF |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| PBSS4612PA | | SOT1061 | Reflow_Soldering_Profile | Reel 7" Q1/T1 | Active | PBSS4612PA,115 (9340 634 89115) | A5 | PBSS4612PA |    | Always Pb-free | 153.0 | 0.71 | 1.41E9 | 1 | 1 |
- 12 V, 6 A NPN low V_CEsat (BISS) transistor PBSS4612PA
- Next generation of NXP® low VCEsat transistors: improved technology for discrete semiconductors PBSS4041SPN
- Thermal behavior of small-signal discretes on multilayer PCBs PBSS9110Z
- PBSS4612PA NXP Product Quality PBSS4612PA
- PBSS4612PA SPICE model PBSS4612PA
- DFN2020-3: plastic thermal enhanced ultra thin small outline package; no leads; 3 terminals; body 2 x 2 x 0.65 mm PMEG6020EPA
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- DFN2020-3; reel pack; standard product orientation; 12NC ending 115 PMEG6020EPA
- PTVSXU1UPA_SERIES
