PBSS5240Y: 40 V PNP低VCEsat (BISS)晶体管
PNP低VCEsat晶体管，采用SOT363 (SC-88)塑料封装。NPN补充：PBSS4240Y。
SOT363
数据手册 (1)
| 名称/描述 | Modified Date |
|---|---|
| 40 V low VCEsat PNP transistor (REV 2.0) PDF (118.0 kB) PBSS5240Y [English] | 28 Feb 2002 |
应用说明 (1)
| 名称/描述 | Modified Date |
|---|---|
| Thermal behavior of small-signal discretes on multilayer PCBs (REV 1.0) PDF (211.0 kB) AN11076 [English] | 12 Jul 2011 |
封装信息 (1)
| 名称/描述 | Modified Date |
|---|---|
| plastic surface-mounted package; 6 leads (REV 1.0) PDF (246.0 kB) SOT363_1 [English] | 08 Feb 2016 |
包装 (2)
| 名称/描述 | Modified Date |
|---|---|
| TSSOP6; Tape reel SMD; standard product orientation 12NC ending 135 (REV 1.0) PDF (187.0 kB) SOT363_135 [English] | 20 Nov 2012 |
| TSSOP6; Tape reel SMD; standard product orientation 12NC ending 115 (REV 1.0) PDF (187.0 kB) SOT363_115 [English] | 15 Nov 2012 |
可靠性与质量信息 (2)
| 名称/描述 | Modified Date |
|---|---|
| PBSS5240Y NXP® Product Reliability (REV 1.1) PDF (82.0 kB) PBSS5240Y_1 [English] | 31 Jan 2015 |
| PBSS5240Y NXP Product Quality (REV 1.2) PDF (74.0 kB) PBSS5240Y_NXP_PRODUCT_QUALITY [English] | 31 Jan 2015 |
支持信息 (3)
| 名称/描述 | Modified Date |
|---|---|
| Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English] | 30 Sep 2013 |
| Wave Soldering Profile (REV 1.0) PDF (20.0 kB) WAVE_SOLDERING_PROFILE [English] | 30 Sep 2013 |
| MAR_SOT363 Topmark (REV 1.0) PDF (104.0 kB) MAR_SOT363 [English] | 03 Jun 2013 |
SPICE
- PBSS5240Y SPICE model (REV 1.4) prm PBSS5240Y_1_2 7/22/2012
订购信息
| 型号 | 状态 | Package version | Package name | 大小 (mm) | Transistor polarity | transistor polarity | Ptot [max] (mW) | number of transistors | VCEO [max] (V) | IC [max] (A) | ICM [max] (A) | hFE [min] | hFE [typ] | fT [min] (MHz) | fT [typ] (MHz) | RCEsat [typ] (mΩ) | VCEsat [max] (mV) | RCEsat [max] (mΩ) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| PBSS5240Y | Active | SOT363 | TSSOP6 | 2 x 1.25 x 0.95 | PNP | 270 | 1 | -40 | -2 | -3 | 300 | 100 | -100 | 200 |
封装环保信息
| 产品编号 | 封装说明 | Outline Version | 回流/波峰焊接 | 包装 | 产品状态 | 部件编号订购码 (12NC) | Marking | 化学成分 | RoHS / 无铅 / RHF | 无铅转换日期 | EFR | IFR(FIT) | MTBF（小时） | MSL | MSL LF |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| PBSS5240Y | | SOT363 | Reflow_Soldering_Profile
Wave_Soldering_Profile Reflow_Soldering_Profile Wave_Soldering_Profile | Reel 11¼" Q1/T1 in LargePack | Active | PBSS5240Y,135 (9340 565 12135) | 52% | PBSS5240Y |    | week 23, 2003 | 153.0 | 0.71 | 1.41E9 | 1 | 1 |
| Reel 7" Q1/T1 | Active | PBSS5240Y,115 (9340 565 12115) | 52% | PBSS5240Y | | week 23, 2003 | 153.0 | 0.71 | 1.41E9 | 1 | 1 |
- 40 V low VCEsat PNP transistor PBSS5240Y
- Thermal behavior of small-signal discretes on multilayer PCBs PBSS9110Z
- PBSS5240Y NXP® Product Reliability PBSS5240Y
- PBSS5240Y NXP Product Quality PBSS5240Y
- MAR_SOT363 Topmark BSS84AKS
- PBSS5240Y SPICE model PBSS5240Y
- plastic surface-mounted package; 6 leads BSS84AKS
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- TSSOP6; Tape reel SMD; standard product orientation 12NC ending 135 pesd5v0l5uy
- TSSOP6; Tape reel SMD; standard product orientation 12NC ending 115 BSS84AKS
- BFU520Y
